XCAU25P-2FFVB676I

The XCAU25P-2FFVB676I is an Artix® UltraScale+ field programmable gate array (FPGA) in a 676-FCBGA package designed for industrial applications. It combines high logic capacity, substantial on-chip memory, and a large I/O count to support complex custom logic and system integration.

Key on-chip resources include 308,437 logic elements, approximately 11.01 Mbits of embedded memory, and 280 I/O pins. The device operates over a 825 mV to 876 mV supply range and is specified for −40 °C to 100 °C, with surface-mount packaging and RoHS compliance.

Key Features

• Core Logic  Provides 308,437 logic elements and approximately 17,625 logic blocks to implement large-scale custom logic and datapath functions.
• Embedded Memory  Approximately 11.01 Mbits of on-chip RAM for buffering, FIFOs, and state storage across high-throughput designs.
• I/O Capacity  280 I/O pins to support multiple interfaces, parallel buses, and mixed-signal front-end connections.
• Power  Low-voltage core operation specified at 825 mV to 876 mV to align with modern power domains.
• Package & Mounting  676-FCBGA package (27 × 27 mm) with surface-mount mounting for compact, high-density PCB integration.
• Temperature & Grade  Industrial-grade operation across −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory Status  RoHS compliant for environmental and manufacturing consistency.

Typical Applications

• Industrial automation and control  Use the FPGA’s logic density and industrial temperature rating to implement motion control, PLC functions, and custom control algorithms.
• High‑density I/O systems  The 280 I/O pins enable protocol bridging, multi-channel sensor interfacing, and complex peripheral aggregation.
• Custom signal processing  Leverage the large logic element count and embedded memory for real-time data processing, filtering, and streaming tasks.
• Embedded systems integration  Integrate glue logic, timing control, and system orchestration functions where compact packaging and low-voltage core operation are required.

Unique Advantages

• High logic capacity: 308,437 logic elements enable implementation of complex finite-state machines, datapaths, and custom accelerators on a single device.
• Substantial on-chip memory: Approximately 11.01 Mbits of embedded RAM reduces external memory dependence and simplifies board design.
• Rich I/O count: 280 I/Os provide flexibility for multiple interfaces and parallel connections without external multiplexing.
• Industrial temperature range: Specified operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact, high-density package: 676-FCBGA (27 × 27 mm) supports high-pin-count designs in a space-efficient footprint.
• RoHS compliant: Meets environmental manufacturing requirements for modern production flows.

Why Choose XCAU25P-2FFVB676I?

The XCAU25P-2FFVB676I positions itself as a high-capacity, industrial-grade FPGA choice for designers who need a balance of logic density, embedded memory, and extensive I/O in a compact FCBGA package. Its specified supply and temperature ranges make it suitable for systems where low-voltage operation and environmental robustness are required.

This device is appropriate for engineering teams building industrial control, I/O-heavy interfaces, and custom signal-processing solutions that benefit from on-chip resources and a well-defined hardware footprint.

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