XCAU25P-L1FFVB676I

The XCAU25P-L1FFVB676I is an Artix® UltraScale+ FPGA packaged in a 676-ball FCBGA (27×27) surface-mount package. It provides a substantial programmable fabric with 308,437 logic elements and approximately 11.01 Mbits of embedded RAM, combined with 280 general-purpose I/O and industrial-grade operating range, making it suitable for complex embedded and control-oriented designs that require high-density logic, on-chip memory and robust operating conditions.

Key Features

• Core Logic  308,437 logic elements (cells) and 17,625 CLBs for large-scale programmable logic implementations.
• Embedded Memory  11,010,048 total RAM bits (approximately 11.01 Mbits) of on-chip memory for buffering, state storage and local data processing.
• I/O Capability  280 I/O pins to support broad board-level connectivity and interfacing needs.
• Package  676-BBGA / 676-FCBGA (27×27) surface-mount package to enable high pin-count, compact board layouts.
• Power  Voltage supply range from 698 mV to 742 mV for core power domain specification.
• Thermal and Grade  Industrial grade device with an operating temperature range of -40 °C to 100 °C suited to demanding environmental conditions.
• RoHS Compliance  Environmentally compliant (RoHS) component.

Typical Applications

• Industrial Systems  Industrial-grade temperature range and extensive I/O make this FPGA suitable for control and automation equipment operating in challenging environments.
• High-density Logic Designs  Large logic element and CLB counts support complex state machines, custom datapaths, and parallel processing implementations.
• Memory-intensive Embedded Processing  Approximately 11.01 Mbits of embedded RAM supports local buffering, packet processing, and on-chip data storage requirements.

Unique Advantages

• High logic capacity: 308,437 logic elements and 17,625 CLBs provide extensive programmable resources for advanced designs.
• Significant on-chip memory: Approximately 11.01 Mbits of embedded RAM reduces reliance on external memory for many buffering and caching needs.
• Generous I/O count: 280 I/O pins simplify system-level integration and reduce the need for additional interface components.
• Industrial-grade operation: Rated for -40 °C to 100 °C operation to support deployment in harsh or temperature-variable environments.
• Compact, high-pin package: 676-FCBGA (27×27) package enables dense board integration while preserving high pin count.
• RoHS compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose XCAU25P-L1FFVB676I?

The XCAU25P-L1FFVB676I positions itself as a robust, high-capacity FPGA option for designs that require large programmable logic resources, meaningful on-chip memory, and substantial I/O in a compact surface-mount package. Its industrial temperature rating and RoHS compliance make it appropriate for applications that demand reliable operation across a broad thermal range.

Choose this device when your design calls for a balance of logic density, embedded RAM, and flexible I/O count in a 676-FCBGA footprint—particularly for industrial and high-density embedded systems where integration and operational robustness are priorities.

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