XCAU25P-L1SFVB784I

The XCAU25P-L1SFVB784I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 784-FCBGA (23×23) surface-mount package. It targets designs that require a high-capacity, reprogrammable digital logic resource with industry-grade operating range.

Key silicon resources include 308,437 logic elements, approximately 11 Mbits of embedded memory (11,010,048 total RAM bits), and support for 304 user I/O. The device operates from a supply range of 698 mV to 742 mV and across an industrial temperature range of −40 °C to 100 °C, and is RoHS compliant.

Key Features

• Core Capacity 308,437 logic elements provide significant programmable logic resources for complex digital designs.
• Embedded Memory Approximately 11 Mbits of on-chip RAM (11,010,048 total RAM bits) for buffering, state storage, and local data processing.
• I/O Density Up to 304 user I/O pins to support multiple parallel interfaces and high-pin-count connectivity.
• Low-Voltage Operation Specified supply range from 698 mV to 742 mV for compatible low-voltage system designs.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package and Mounting 784-BFBGA / 784-FCBGA (23×23) surface-mount package offering a compact footprint with high pin count.
• Regulatory Compliance RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

• Custom Digital Processing — Implement complex programmable logic and custom data paths using 308,437 logic elements and embedded memory.
• High‑density I/O Systems — Designs requiring many external interfaces benefit from up to 304 user I/O pins for parallel and multi-channel connectivity.
• Industrial Control and Instrumentation — Industrial-grade temperature range (−40 °C to 100 °C) and RoHS compliance make the device suitable for industrial electronic systems.

Unique Advantages

• Substantial Logic Resources: 308,437 logic elements enable large-scale, reconfigurable digital designs without immediate need for multiple devices.
• Significant On-chip Memory: Approximately 11 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
• High I/O Count: 304 I/O pins support complex interfacing requirements and simplify board-level routing for multi-channel systems.
• Industrial-grade Operation: Specified operating range from −40 °C to 100 °C supports deployment in demanding thermal environments.
• Compact, High‑pin Package: 784-FCBGA (23×23) packing delivers a high pin density in a surface-mount form factor.
• Low-voltage Compatibility: Narrow supply range of 698 mV to 742 mV for designs targeting low-voltage power domains.

Why Choose XCAU25P-L1SFVB784I?

The XCAU25P-L1SFVB784I combines large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact 784-FCBGA surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for applications that require durable operation and regulatory alignment.

This device is positioned for engineers and system designers who need a reprogrammable, high-density FPGA solution from AMD with clearly defined electrical, thermal, and packaging characteristics—providing a stable foundation for scalable, long-lived designs.

Request a quote or submit a pricing and availability inquiry to evaluate the XCAU25P-L1SFVB784I for your next project.