XCKU025-2FFVA1156E
| Part Description |
Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA, FCBGA |
|---|---|
| Quantity | 671 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 312 | Voltage | 922 mV - 979 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 18180 | Number of Logic Elements/Cells | 318150 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13004800 |
Overview of XCKU025-2FFVA1156E – Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA, FCBGA
The XCKU025-2FFVA1156E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 1156-ball FCBGA package. It provides a substantial amount of programmable logic, on-chip memory, and I/O capacity in a surface-mount 1156-FCBGA (35×35) package.
Delivered in an Extended grade with a specified core supply range and operating temperature window, this device is intended for designs that require a defined combination of logic resources, embedded RAM, and multiple I/O channels.
Key Features
- Logic resources 318,150 logic elements arranged across 18,180 CLBs, providing significant programmable capacity for complex logic implementations.
- Embedded memory Approximately 13.0 Mbits of on-chip RAM (13,004,800 bits) for buffering, lookup tables, and intermediate data storage.
- I/O and package 312 user I/O pins in a 1156-BBGA, FCBGA package; supplier device package listed as 1156-FCBGA (35×35). Surface-mount mounting type supports compact board-level integration.
- Power Specified core voltage supply range of 922 mV to 979 mV for the programmable fabric.
- Operating conditions Extended grade with an operating temperature range of 0 °C to 100 °C.
- Environmental compliance RoHS compliant.
Unique Advantages
- Substantial programmable capacity: 318,150 logic elements enable large-scale logic implementations without external programmable resources.
- On-chip memory for data handling: Approximately 13.0 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
- Ample I/O in a compact package: 312 I/Os paired with a 1156-FCBGA (35×35) package supports high I/O count designs while conserving board space.
- Controlled power envelope: The defined 922 mV–979 mV supply range supports precise power delivery and regulator selection.
- Extended-grade operation: Rated for 0 °C to 100 °C operation to meet systems requiring this temperature range.
- Regulatory alignment: RoHS compliance supports environmental requirements for modern electronics production.
Why Choose XCKU025-2FFVA1156E?
The XCKU025-2FFVA1156E combines a large complement of logic elements, approximately 13.0 Mbits of embedded RAM, and 312 I/Os in a 1156-FCBGA surface-mount package, offering a balanced platform for designs that need significant on-chip resources and multi-channel connectivity. Its specified supply range and extended operating grade provide clear parameters for power and thermal planning.
This device is suited for development teams and integrators seeking a Kintex® UltraScale™ FPGA with verifiable logic, memory, I/O, and environmental characteristics—enabling predictable integration, scaling, and long-term support in qualifying applications.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for XCKU025-2FFVA1156E.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








