XCKU025-2FFVA1156E

IC FPGA 312 I/O 1156FCBGA
Part Description

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA, FCBGA

Quantity 671 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O312Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs18180Number of Logic Elements/Cells318150
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13004800

Overview of XCKU025-2FFVA1156E – Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA, FCBGA

The XCKU025-2FFVA1156E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 1156-ball FCBGA package. It provides a substantial amount of programmable logic, on-chip memory, and I/O capacity in a surface-mount 1156-FCBGA (35×35) package.

Delivered in an Extended grade with a specified core supply range and operating temperature window, this device is intended for designs that require a defined combination of logic resources, embedded RAM, and multiple I/O channels.

Key Features

  • Logic resources  318,150 logic elements arranged across 18,180 CLBs, providing significant programmable capacity for complex logic implementations.
  • Embedded memory  Approximately 13.0 Mbits of on-chip RAM (13,004,800 bits) for buffering, lookup tables, and intermediate data storage.
  • I/O and package  312 user I/O pins in a 1156-BBGA, FCBGA package; supplier device package listed as 1156-FCBGA (35×35). Surface-mount mounting type supports compact board-level integration.
  • Power  Specified core voltage supply range of 922 mV to 979 mV for the programmable fabric.
  • Operating conditions  Extended grade with an operating temperature range of 0 °C to 100 °C.
  • Environmental compliance  RoHS compliant.

Unique Advantages

  • Substantial programmable capacity: 318,150 logic elements enable large-scale logic implementations without external programmable resources.
  • On-chip memory for data handling: Approximately 13.0 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
  • Ample I/O in a compact package: 312 I/Os paired with a 1156-FCBGA (35×35) package supports high I/O count designs while conserving board space.
  • Controlled power envelope: The defined 922 mV–979 mV supply range supports precise power delivery and regulator selection.
  • Extended-grade operation: Rated for 0 °C to 100 °C operation to meet systems requiring this temperature range.
  • Regulatory alignment: RoHS compliance supports environmental requirements for modern electronics production.

Why Choose XCKU025-2FFVA1156E?

The XCKU025-2FFVA1156E combines a large complement of logic elements, approximately 13.0 Mbits of embedded RAM, and 312 I/Os in a 1156-FCBGA surface-mount package, offering a balanced platform for designs that need significant on-chip resources and multi-channel connectivity. Its specified supply range and extended operating grade provide clear parameters for power and thermal planning.

This device is suited for development teams and integrators seeking a Kintex® UltraScale™ FPGA with verifiable logic, memory, I/O, and environmental characteristics—enabling predictable integration, scaling, and long-term support in qualifying applications.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for XCKU025-2FFVA1156E.

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