XCKU025-2FFVA1156I

The XCKU025-2FFVA1156I is an industrial-grade Kintex® UltraScale™ FPGA in a 1156-FCBGA (35×35) package from AMD. It provides a high-density programmable logic resource combined with embedded memory and a substantial I/O count for demanding embedded and industrial applications.

With 318,150 logic elements, approximately 13.0 Mbits of embedded memory and 312 user I/Os, this device targets designs that require significant on-chip logic, flexible I/O connectivity, and an extended operating temperature range.

Key Features

• Core Logic  318,150 logic elements deliver a large programmable fabric for implementing complex digital functions.
• Embedded Memory  Approximately 13.0 Mbits of on-chip RAM for buffering, state storage and algorithm implementation.
• I/O Density  312 user I/Os enable broad connectivity to peripherals, sensors and external devices.
• Power/Fabric Voltage  Supported core supply range of 922 mV to 979 mV for the device core voltage domain.
• Package & Mounting  1156-FCBGA (35×35) package, surface-mount assembly for compact board integration.
• Operating Range & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant, meeting standard restrictions on certain hazardous substances.

Typical Applications

• Industrial Control & Automation  Use the industrial-grade temperature rating and high logic density to implement programmable controllers, motor drives and process control logic.
• Embedded Signal Processing  Leverage 318,150 logic elements and approximately 13.0 Mbits of embedded memory to implement filtering, aggregation and custom data-paths.
• High‑I/O Embedded Systems  The 312 I/Os support complex sensor interfacing, board-level peripherals and mixed-signal front ends in compact designs.

Unique Advantages

• High programmable capacity: 318,150 logic elements provide headroom for large state machines, datapaths and custom hardware accelerators.
• Substantial on‑chip memory: Approximately 13.0 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing tasks.
• Extensive I/O: 312 user I/Os enable flexible connectivity choices and simplify board-level interfacing.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet environmental demands of industrial installations.
• Compact BGA package: 1156-FCBGA (35×35) allows high-density integration while supporting surface-mount assembly processes.
• Regulatory compliance: RoHS compliance supports environmentally conscious product builds and regulatory requirements.

Why Choose XCKU025-2FFVA1156I?

The XCKU025-2FFVA1156I combines a large programmable fabric, significant on‑chip memory and a high I/O count in an industrial-grade FPGA package. It is well suited for designs that require substantial custom logic implementation, embedded data buffering and broad connectivity within a robust thermal envelope.

Choose this Kintex® UltraScale™ device when your project requires scalable programmable resources, RoHS compliance and a compact FCBGA footprint for board-level integration in industrial environments.

Request a quote or submit an inquiry to obtain pricing and availability information for the XCKU025-2FFVA1156I.