XCKU035-1FBVA900I

The XCKU035-1FBVA900I is a Kintex® UltraScale™ Field Programmable Gate Array provided in a 900‑ball FCBGA package. It is an industrial‑grade FPGA built to deliver high logic density and on‑chip memory capacity for demanding embedded and system designs.

With 444,343 logic elements, approximately 19.46 Mbits of embedded memory and 468 I/O, this device is suited to applications that require substantial programmable logic, significant internal RAM, and a robust I/O complement within a surface‑mount 900‑FCBGA (31×31) package.

Key Features

• Core Logic  444,343 logic elements provide large-scale programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM to support buffering, lookup tables and data path storage.
• I/O Count  468 user I/O pins to accommodate broad peripheral and interface connectivity within a single device.
• Package  900‑BBGA, FCBGA package; supplier device package specified as 900‑FCBGA (31×31) for high‑density board integration.
• Power  Core supply range specified from 922 mV to 979 mV for precise power domain planning.
• Environmental & Mounting  Industrial grade device with operating temperature range of −40 °C to 100 °C and surface‑mount packaging for standard PCB assembly processes.
• Regulatory  RoHS compliant.

Unique Advantages

• High logic density: 444,343 logic elements enable consolidation of complex functions into a single FPGA, reducing the need for multiple discrete devices.
• Substantial on‑chip memory: Approximately 19.46 Mbits of embedded RAM supports large buffering and on‑device data processing, minimizing external memory requirements.
• Extensive I/O capability: 468 I/O pins simplify integration with multiple interfaces and peripherals without immediate need for I/O expanders.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in environments requiring extended thermal robustness.
• Compact, high‑density package: 900‑FCBGA (31×31) packaging supports space‑constrained board layouts while maintaining high pin count.
• Precise core power specification: Defined supply range (922 mV–979 mV) supports controlled power delivery and design planning.

Why Choose XCKU035-1FBVA900I?

The XCKU035-1FBVA900I positions itself as a high‑capacity Kintex® UltraScale™ FPGA option for industrial designs that require a combination of large logic resources, meaningful on‑chip memory, and a broad I/O complement in a single surface‑mount package. Its specified operating temperature range and RoHS compliance add practical reliability and regulatory alignment for production deployments.

This device is suited for development teams and procurement looking to scale complex programmable logic into a compact 900‑ball FCBGA footprint while maintaining careful power and thermal planning. The clear, quantifiable specifications support predictable integration and long‑term product planning.

Request a quote or submit a request for pricing and availability to begin your procurement or design planning process.