XCKU035-1SFVA784I

The XCKU035-1SFVA784I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It provides substantial programmable logic, embedded memory, and a high I/O count in a compact surface-mount BGA package.

Rated as an industrial-grade device with an operating range of -40°C to 100°C, this FPGA is targeted at designs that require high logic density, significant on-chip RAM, and broad interfacing capability.

Key Features

• Core Logic 444,343 logic elements provide the programmable fabric for implementing complex digital designs.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
• I/O Resources 468 user I/O pins to accommodate multiple external interfaces and system connections.
• Package & Mounting 784‑BFBGA, FCCSP package (supplier package: 784‑FCCSPBGA, 23×23) in a surface-mount form factor for dense PCB integration.
• Power Specified supply window from 922 mV to 979 mV for core power planning.
• Temperature & Grade Industrial grade with an operating temperature range of -40°C to 100°C for use in demanding environments.
• Compliance RoHS‑compliant materials.

Typical Applications

• Industrial Control Systems Industrial-grade temperature rating and robust packaging support deployment in factory automation and control equipment.
• High-Density Logic Implementations Large logic element count enables complex acceleration, protocol processing, and custom compute functions.
• Memory-Intensive FPGA Designs Embedded RAM capacity supports buffering, frame storage, and other on-chip memory needs without immediate reliance on external memory.
• I/O-Rich Systems High I/O pin count allows multiple peripheral interfaces and signal connections directly to the FPGA.

Unique Advantages

• High logic density: 444,343 logic elements allow consolidation of complex functions into a single device.
• Substantial on-chip memory: Approximately 19.456 Mbits of RAM reduces external memory requirements and simplifies board design.
• Extensive I/O capacity: 468 I/O pins enable flexible interfacing and integration with a wide range of peripherals.
• Industrial temperature support: −40°C to 100°C operation helps ensure reliable performance in demanding environments.
• Compact, high-density package: 784‑BFBGA (784‑FCCSPBGA, 23×23) surface-mount package supports space-constrained board layouts.
• RoHS compliant: Conforms to materials compliance standards for modern production requirements.

Why Choose XCKU035-1SFVA784I?

The XCKU035-1SFVA784I integrates a high count of logic elements, substantial on-chip RAM, and a large I/O complement in an industrial-grade, surface-mount BGA package. These characteristics make it suitable for designs that demand dense programmable logic, significant embedded memory, and reliable operation across a wide temperature range.

Engineers seeking a scalable, high-capacity FPGA for industrial or high-density board designs will find this device offers a combination of integration and robustness aligned to those needs.

Request a quote or submit an inquiry for XCKU035-1SFVA784I to receive pricing and availability information.