XCKU035-2FBVA900I

The XCKU035-2FBVA900I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) offered by AMD. It delivers a large on-chip resource set—multi-hundred-thousand logic elements, substantial embedded memory, and hundreds of general-purpose I/O—in a 900‑ball FCBGA package targeted at industrial designs.

This device is suited for applications that require significant programmable logic capacity, abundant embedded RAM, and wide I/O counts, while operating across an industrial temperature range and standard surface-mount packaging.

Key Features

• Logic Capacity  444,343 logic elements and 25,391 CLBs provide a high-density programmable fabric for complex digital logic and state-machine implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffers, FIFOs, and on-chip data storage for streaming and packetized workloads.
• I/O  468 general-purpose I/O pins to support extensive peripheral, sensor, or bus interfacing requirements.
• Power  Supported core supply range of 922 mV to 979 mV, allowing precise power provisioning for the FPGA core domain.
• Package & Mounting  900‑ball FCBGA (900‑BBGA) package in a 31 × 31 mm supplier package with surface-mount mounting type for board-level integration.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Automation  Implement custom control logic, protocol bridging, and I/O aggregation using the device's large logic and I/O resources at industrial temperature ranges.
• Communications Equipment  Use the substantial logic capacity and embedded memory to implement packet processing, framing, and custom interface logic.
• Test & Measurement  Build instrument control, data acquisition preprocessing, and real‑time signal handling leveraging abundant on-chip RAM and logic.
• High-density Embedded Systems  Integrate complex system functions and multiple peripheral interfaces on a single FPGA platform with 468 I/O.

Unique Advantages

• High logic density: 444,343 logic elements enable complex designs and feature-rich implementations without immediate need for multiple devices.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces external memory dependency for many buffering and streaming tasks.
• Extensive I/O capacity: 468 I/O pins allow direct connection to numerous peripherals and interfaces, simplifying board-level routing and system partitioning.
• Industrial temperature support: −40 °C to 100 °C rating supports deployment in temperature-variable environments.
• Compact, surface-mount package: 900‑ball FCBGA (31 × 31 mm) provides a balance of pin count and board area for high-density applications.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XCKU035-2FBVA900I?

The XCKU035-2FBVA900I combines high logic capacity, substantial embedded memory, and hundreds of I/O in a single industrial-grade FPG A package. Its power supply range and surface-mount 900‑FCBGA footprint make it suitable for dense, board-level system designs that require stable operation across −40 °C to 100 °C.

This device is appropriate for engineering teams and system designers building industrial automation, communications, test equipment, or other embedded systems that need a robust, high-capacity programmable logic solution with significant on-chip RAM and broad I/O support.

Request a quote or submit an inquiry for pricing and availability for the XCKU035-2FBVA900I to evaluate it for your next design.