XCKU035-2SFVA784I

The XCKU035-2SFVA784I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) supplied in a 784-pin FCCSP/BFBGA package. It delivers a large logic fabric with 444,343 logic elements and approximately 19.456 Mbits of embedded memory, together with up to 468 general-purpose I/O pins for dense system integration.

Designed for industrial-grade applications, this surface-mount FPGA operates across a supply range of 922 mV to 979 mV and an operating temperature range of -40 °C to 100 °C, enabling use in environments that require extended temperature tolerance.

Key Features

• Logic Capacity  Provides 444,343 logic elements to implement complex digital functions and custom processing pipelines.
• On-chip Memory  Includes approximately 19.456 Mbits of embedded memory for buffering, state storage, and data processing tasks.
• I/O Count  Up to 468 I/O pins support high-density peripheral and board-level connectivity for multiple interfaces and signal domains.
• Power Supply  Operates within a supply range of 922 mV to 979 mV, allowing predictable power planning for board designs.
• Package & Mounting  Supplied in a 784-FCCSPBGA (23×23) / 784-BFBGA package and intended for surface-mount assembly to support compact, high-density PCB layouts.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C, suitable for industrial environments requiring wider temperature tolerance.
• Regulatory Status  RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control  Leverages industrial temperature rating and high I/O count for sensor interfacing, motor control logic, and factory automation systems.
• High-density Digital Processing  Uses the large logic element count and on-chip memory to implement complex signal processing, protocol handling, and custom datapaths.
• Compact System Integration  The 784-FCCSPBGA surface-mount package enables compact board designs that require many I/Os and substantial programmable logic in a small footprint.

Unique Advantages

• Substantial Logic Resources: 444,343 logic elements provide the capacity needed for large-scale, custom digital designs without immediately moving to external coprocessors.
• Significant Embedded Memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for many buffering and temporary storage tasks.
• High I/O Density: Up to 468 I/Os simplify board-level interfacing and allow consolidation of multiple peripheral connections directly to the FPGA.
• Industrial Temperature Rating: Operation from -40 °C to 100 °C supports deployment in temperature-challenging industrial environments.
• Compact Surface-Mount Package: The 784-FCCSPBGA (23×23) / 784-BFBGA package supports high-density PCB layouts while maintaining a robust pin count.
• RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose XCKU035-2SFVA784I?

The XCKU035-2SFVA784I positions itself as a high-capacity, industrial-grade Kintex UltraScale FPGA suited to designs that need substantial programmable logic, on-chip memory, and large I/O connectivity within a compact surface-mount package. Its combination of 444,343 logic elements, approximately 19.456 Mbits of embedded RAM, and up to 468 I/Os makes it appropriate for systems that require dense integration and reliable operation across a wide temperature range.

Choose this device when your project requires scalable programmable logic resources and industrial temperature tolerance delivered in a space-efficient 784-pin FCCSP/BFBGA package, together with RoHS compliance for modern manufacturing.

Request a quote or submit a request for pricing and availability to begin specifying XCKU035-2SFVA784I for your next industrial or high-density FPGA design.