XCKU035-3SFVA784E

The XCKU035-3SFVA784E is a Kintex® UltraScale™ field programmable gate array (FPGA) IC optimized for designs that require high logic density and substantial on-chip memory. It combines a large logic fabric with significant embedded RAM and a high I/O count, delivered in a 784-ball FCCSP/BFBGA package for surface-mount integration.

This device is targeted at systems that need programmable digital logic, flexible I/O routing, and compact board-level packaging while operating within a core supply range of 0.970–1.030 V and an ambient temperature range of 0 °C to 100 °C.

Key Features

• Logic Capacity — 444,343 logic elements provide substantial programmable logic resources for complex digital designs and algorithm implementation.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and data-path implementations.
• I/O Resources — 468 general-purpose I/O pins to support wide peripheral and signaling requirements across interfaces.
• Power and Voltage — Core voltage supply range of 0.970 V to 1.030 V for compatibility with target power domains.
• Package and Mounting — Surface-mount 784-ball BFBGA / FCCSP package; supplier device package listed as 784-FCCSPBGA (23×23) for compact PCB footprint and high-pin-count routing.
• Operating Range — Grade: Extended; specified ambient operating temperature range from 0 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Leverage 444,343 logic elements and embedded RAM for data-path acceleration and custom processing blocks.
• Interface consolidation — Use 468 I/O pins to bridge multiple peripherals and high-pin-count interfaces on a single device.
• Compact system integration — The 784-ball FCCSP/BFBGA surface-mount package enables high functionality in space-constrained PCB designs.

Unique Advantages

• Substantial logic resources: 444,343 logic elements allow complex functions and large-scale integration within a single FPGA.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design.
• High I/O count: 468 I/O pins support extensive connectivity and flexible interfacing to peripherals and board-level buses.
• Compact, high-density package: 784-ball FCCSP/BFBGA (23×23) enables high pin count in a compact footprint for space-constrained applications.
• Controlled power envelope: Defined core supply range (0.970–1.030 V) supports predictable power planning and voltage rail design.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XCKU035-3SFVA784E?

The XCKU035-3SFVA784E positions itself as a high-capacity, surface-mount Kintex® UltraScale FPGA that balances large programmable logic and embedded memory with extensive I/O in a compact 784-ball package. Its specification set—hundreds of thousands of logic elements, approximately 19.456 Mbits of on-chip RAM, and 468 I/O—makes it suitable for designs that require dense integration of digital functions and flexible board-level connectivity.

Designed for developers and procurement teams seeking scalable FPGA resources with defined operating and power parameters, this device offers a clear path for integrating complex logic, consolidating interfaces, and reducing external component needs while adhering to RoHS requirements.

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