XCKU035-L1FBVA900I

The XCKU035-L1FBVA900I is a Kintex® UltraScale™ field programmable gate array (FPGA) IC designed for applications that require high logic density, substantial on-chip memory, and a large number of external interfaces. This industrial‑grade device combines 25,391 CLBs and 444,343 logic elements with approximately 19.456 Mbits of embedded memory to support complex logic and buffering tasks.

Packaged in a 900‑FCBGA (31×31) surface‑mount package and rated for operation from −40 °C to 100 °C, the device provides a compact, low‑voltage FPGA option for systems with heavy I/O and demanding thermal requirements.

Key Features

• Core Logic 25,391 CLBs and 444,343 logic elements for implementing large-scale, high‑complexity designs.
• Embedded Memory Approximately 19.456 Mbits of on‑chip RAM to support data buffering, LUTs, and state storage.
• I/O Capacity 468 user I/Os to support extensive external interfacing and multi‑lane connectivity.
• Power Supported supply range of 880 mV to 979 mV for core operation.
• Package & Mounting 900‑FCBGA (31×31) / 900‑BBGA package in a surface‑mount form factor for dense PCB integration.
• Operating Range & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C, suitable for thermally demanding environments.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control & Automation — Industrial grading and a −40 °C to 100 °C operating range enable deployment in manufacturing and automation systems that require reliable, long‑life digital logic.
• High‑Density I/O Systems — The device’s 468 I/Os support multi‑channel data acquisition, protocol bridging, and interface‑rich subsystems.
• Compute- and Memory‑Intensive FPGA Tasks — Large logic capacity and approximately 19.456 Mbits of embedded RAM accommodate complex algorithms, buffering, and on‑chip data processing.
• Compact, High‑Performance Board Designs — The 900‑FCBGA (31×31) package delivers a space‑efficient solution for compact, performance‑focused electronic assemblies.

Unique Advantages

• High Logic Density: 444,343 logic elements and 25,391 CLBs provide the resources needed for sophisticated digital designs without external FPGA partitioning.
• Substantial On‑Chip Memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on off‑chip memory for many buffering and state‑store use cases.
• Extensive I/O Count: 468 I/Os enable complex interfacing and multi‑channel connectivity directly on the FPGA package.
• Industrial‑Grade Thermal Range: −40 °C to 100 °C rating supports deployment in harsh or thermally variable environments.
• Compact Ball Grid Package: 900‑FCBGA (31×31) delivers a high‑density package for space‑constrained PCB layouts.
• Low‑Voltage Core Operation: Core supply between 880 mV and 979 mV supports low‑power core domains and modern board power architectures.

Why Choose XCKU035-L1FBVA900I?

The XCKU035-L1FBVA900I positions itself as a high‑density, industrial‑grade FPGA option within the Kintex® UltraScale™ family, offering a balance of large logic capacity, significant embedded memory, and extensive I/O — all in a compact 900‑FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long‑lifecycle systems that require robust thermal performance and regulatory conformity.

This device is well suited for engineering teams building systems that demand heavy logic resources, substantial on‑chip RAM, and high connector counts while maintaining a compact PCB footprint and industrial operating range.

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