XCKU035-3FBVA900E

The XCKU035-3FBVA900E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 900-ball FCBGA package. It integrates a high quantity of logic resources, embedded memory, and a substantial I/O count in a surface-mount footprint.

This device provides approximately 444,343 logic elements, approximately 19.5 Mbits of on-chip RAM, and 468 I/O pins, with a core voltage range of 970 mV to 1.03 V and an extended-grade operating temperature range of 0 °C to 100 °C.

Key Features

• Logic resources — 25,391 CLBs and approximately 444,343 logic elements for complex digital designs and large-scale integration.
• Embedded memory — Approximately 19.5 Mbits of on-chip RAM to support data buffering, packet handling, and intermediate storage.
• I/O connectivity — 468 general-purpose I/O pins to interface with peripherals, high-speed transceivers, or multi-board systems.
• Power — Core voltage supply range from 970 mV to 1.03 V to match system power rails and core requirements.
• Package and mounting — 900-BBGA, FCBGA package; supplier device package 900-FCBGA (31×31); designed for surface-mount assembly.
• Grade and environmental — Extended grade device rated for operation from 0 °C to 100 °C; RoHS compliant.

Unique Advantages

• High logic density: The large number of logic elements and CLBs enables implementation of complex algorithms and multi-function designs on a single device.
• Substantial embedded memory: Nearly 19.5 Mbits of on-chip RAM reduces the need for external memory in many buffering and processing tasks.
• Extensive I/O capacity: 468 I/O pins provide flexibility for system partitioning, parallel interfaces, and dense board-level connectivity.
• Compact, manufacturable package: 900-FCBGA (31×31) surface-mount package supports high-density board layouts while aligning with standard assembly processes.
• Defined operating window: Extended-grade operation from 0 °C to 100 °C and RoHS compliance support deployment in temperature-controlled and environmentally conscious designs.
• Low-voltage core compatibility: The 970 mV–1.03 V supply range aligns with modern low-voltage FPGA core requirements for power-managed systems.

Why Choose XCKU035-3FBVA900E?

The XCKU035-3FBVA900E positions itself as a high-capacity Kintex UltraScale FPGA offering a balance of large logic resource counts, significant on-chip memory, and broad I/O connectivity in a 900-ball FCBGA package. Its extended-grade specification and defined voltage range make it suitable for designs that require reliable operation within the 0 °C to 100 °C window.

This device is well suited to engineering teams aiming to consolidate functions, reduce external memory requirements, and leverage dense I/O in a surface-mount form factor while maintaining clear, verifiable electrical and thermal operating parameters.

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