XCKU035-2SFVA784E

The XCKU035-2SFVA784E is a Kintex® UltraScale™ field programmable gate array (FPGA) offered in a 784-BFBGA, FCCSP package. It provides a large logic fabric combined with embedded memory and substantial I/O capacity for complex programmable designs.

With approximately 444,343 logic elements and approximately 19.456 Mbits of embedded memory, this device targets designs that require high logic density, on-chip storage, and up to 468 I/O connections while operating within a 922 mV to 979 mV supply range and an operating temperature range of 0 °C to 100 °C.

Key Features

• Core Logic Capacity  Approximately 444,343 logic elements to implement large-scale custom logic and control functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Resources  468 available I/Os to support extensive external connectivity and interfacing requirements.
• Power Range  Specified voltage supply range of 922 mV to 979 mV for device core operation.
• Package and Mounting  784-BFBGA, FCCSP package (supplier package: 784-FCCSPBGA (23×23)); surface-mount mounting type for compact board-level integration.
• Operating Grade and Temperature  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• Programmable Logic Acceleration  Use the large logic element count to implement custom accelerators and specialized datapath logic where on-chip programmability is required.
• Memory-Intensive Functions  Approximately 19.456 Mbits of embedded RAM supports local buffering, packet queues, and temporary storage inside FPGA logic.
• High-Density I/O Systems  With 468 I/Os and a compact 784-FCCSPBGA (23×23) package, the device is suited for designs needing substantial external interfacing on a small footprint.

Unique Advantages

• High logic density: Approximately 444,343 logic elements enable complex, large-scale logic implementations without external programmable devices.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O headroom: 468 I/Os provide flexibility for multiple interface standards and high pin-count designs.
• Compact, board-ready packaging: 784-FCCSPBGA (23×23) surface-mount package supports dense PCB layouts while maintaining robust connectivity.
• Extended operating grade: Rated for 0 °C to 100 °C operation to meet a range of temperature requirements.
• RoHS compliant: Meets common environmental compliance requirements for electronics manufacturing.

Why Choose XCKU035-2SFVA784E?

The XCKU035-2SFVA784E combines substantial logic capacity, embedded memory, and a high I/O count in a compact FCCSPBGA footprint. This balance of integration and density makes it suitable for designers who require programmable logic and on-chip storage without compromising board space or I/O connectivity.

Its extended grade rating and RoHS compliance support reliable deployment in a variety of commercial and industrial electronic systems, while the defined supply voltage and thermal range provide clear electrical and environmental parameters for system design and integration.

Request a quote or submit a procurement inquiry to get pricing and availability for XCKU035-2SFVA784E. Our team can provide the information needed to move your design forward.