XCKU035-2FBVA900E

The XCKU035-2FBVA900E is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD designed to deliver substantial programmable logic capacity and on-chip memory in a high-pin-count FCBGA package. It combines a large logic fabric with significant embedded RAM and a high I/O count to address demanding, integration-focused FPGA designs.

Key device characteristics include 444,343 logic elements, approximately 19.456 Mbits of embedded memory, 468 I/O pins, a 900-FCBGA (31×31) surface-mount package, an operating temperature range of 0 °C to 100 °C, and a supply range of 922 mV to 979 mV.

Key Features

• Core (Logic Capacity)  Provides 444,343 logic elements (cells) and 25,391 CLBs for implementing complex programmable logic and multiple functions on a single device.
• Embedded Memory  Includes approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
• I/O and Connectivity  468 general-purpose I/O pins enable high pin-count designs and flexible interface implementations.
• Power Supply  Operates from a defined supply range of 922 mV to 979 mV to match system power requirements.
• Package and Mounting  900-FCBGA (31×31) / 900-BBGA surface-mount package for compact board-level integration.
• Temperature and Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C.

Typical Applications

• Data Acceleration and Custom Logic  Leverage the high logic element count and embedded memory to implement custom accelerators and specialized data-paths.
• High-Density System Integration  Consolidate multiple functions onto a single FPGA using abundant logic and I/O resources.
• Memory-Intensive Designs  Use the approximately 19.456 Mbits of on-chip RAM for buffering, packet handling, or local state storage.
• Multi-Interface Aggregation  Support aggregation and management of multiple interfaces with 468 available I/O pins.

Unique Advantages

• High Logic Density: 444,343 logic elements enable implementation of complex designs and integration of multiple subsystems.
• Significant On-Chip Memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory for many workloads.
• Large I/O Count: 468 I/Os simplify board-level interface consolidation and parallel connectivity.
• Compact, High-Pin Package: 900-FCBGA (31×31) surface-mount package balances pin density with board footprint for space-constrained designs.
• Deterministic Supply and Thermal Window: Defined supply range (922 mV–979 mV) and extended-grade temperature range (0 °C–100 °C) support predictable system integration.
• Manufacturer Backing: Produced by AMD as part of the Kintex® UltraScale™ family.

Why Choose XCKU035-2FBVA900E?

The XCKU035-2FBVA900E is positioned for designs that require a combination of large programmable logic resources, substantial on-chip memory, and a high I/O count in a 900-FCBGA surface-mount package. Its extended-grade temperature range and defined supply window aid in predictable integration into a variety of electronic systems.

Engineers and procurement teams seeking a high-capacity Kintex® UltraScale™ FPGA from AMD will find this device suited to consolidate functionality, reduce external component count, and deliver a scalable platform for complex, logic- and memory-intensive designs.

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