XCKU035-1SFVA784C

The XCKU035-1SFVA784C is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC offering a high-density programmable logic fabric with 444,343 logic elements and approximately 19.456 Mbits of embedded memory. Built in a 784-BFBGA / 784-FCCSPBGA (23×23) package and specified for commercial operation, it delivers substantial I/O capacity and on-chip resources for complex digital designs.

With 468 I/Os, a defined core voltage range of 922 mV–979 mV, and a surface-mount package, this FPGA targets designs that require large-scale integration of custom logic and memory while adhering to commercial temperature and RoHS compliance requirements.

Key Features

• Core Logic Capacity — 444,343 logic elements provide extensive programmable fabric for implementing complex digital systems and large logic designs.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and custom memory architectures without external memory for certain functions.
• I/O Resources — 468 I/O pins to support wide interfacing options for peripherals, mezzanine connectors, and board-level interfaces.
• Package and Mounting — Available in a 784-BFBGA / 784-FCCSPBGA (23×23) package with surface-mount mounting for common PCB assembly flows.
• Power — Core supply specified between 922 mV and 979 mV, enabling designs to target the documented operating voltage window.
• Operating Range and Grade — Commercial-grade device rated for 0 °C to 85 °C operation and compliant with RoHS

Typical Applications

• Custom Digital Systems — Implement large-scale programmable logic and control functions using the expansive logic element count and embedded RAM.
• High-Channel I/O Designs — Systems requiring numerous I/O connections benefit from the 468 available I/Os for direct interfacing and board-level integration.
• Prototyping and Development — Use the device for validating complex algorithms and system architectures that require significant on-chip logic and memory resources.

Unique Advantages

• High Logic Density: 444,343 logic elements enable consolidation of complex functions into a single FPGA, reducing the need for multiple discrete devices.
• Substantial On-Chip Memory: Approximately 19.456 Mbits of embedded RAM supports local buffering and state storage for data-intensive designs.
• Extensive I/O Count: 468 I/Os provide flexibility for multi-channel interfaces, sensor arrays, and high-pin-count connectors.
• Compact Surface-Mount Package: The 784-BFBGA / 784-FCCSPBGA (23×23) package supports dense PCB layouts and standard assembly processes.
• Commercial Temperature Rating: Specified for 0 °C to 85 °C operation to meet typical commercial deployment environments.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing.

Why Choose XCKU035-1SFVA784C?

The XCKU035-1SFVA784C delivers a combination of large logic capacity, significant embedded memory, and a high I/O count in a compact surface-mount package, making it suitable for engineers building complex programmable systems within commercial temperature limits. Its clear electrical and mechanical specifications simplify integration into designs that require defined core voltage and package dimensions.

This FPGA is well suited for teams needing scalable programmable logic resources and a predictable hardware platform for development, prototyping, or volume applications where on-chip logic, memory, and I/O density are primary considerations.

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