XCKU035-1FFVA1156C

The XCKU035-1FFVA1156C is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD designed for applications requiring substantial logic capacity, embedded memory, and a high I/O count. It combines a large number of logic elements with significant on-chip RAM in a compact 1156-FCBGA (35×35) surface-mount package.

This commercial-grade device supports designs that need dense, reconfigurable digital logic and extensive I/O interfacing within a controlled operating range, and it is RoHS compliant.

Key Features

• Logic Capacity  Approximately 444,343 logic elements to implement complex digital functions and custom hardware architectures.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffer, FIFO, and local storage requirements.
• High I/O Count  520 user I/O pins for broad interface and high-channel-count connectivity options.
• Package  1156-FCBGA (35×35) ball grid array provides a compact, surface-mount solution for space-constrained boards.
• Power Supply Range  Specified core voltage support from 922 mV to 979 mV for integration into regulated power rails.
• Operating Range  Commercial temperature range of 0 °C to 85 °C suitable for a wide range of indoor and controlled-environment applications.
• Mounting and Compliance  Surface-mount FCBGA package and RoHS compliance for modern assembly and environmental requirements.

Typical Applications

• Custom Digital Processing  Use the device to implement complex, reconfigurable logic blocks for application-specific processing and prototyping.
• High-Density I/O Aggregation  Leverage 520 I/Os to consolidate multiple interfaces or implement multi-channel front-end aggregation on a single FPGA.
• Memory-Intensive Logic  Deploy embedded RAM for buffering, packet aggregation, or other memory-backed processing tasks within the FPGA fabric.
• Compact Board Designs  The 1156-FCBGA package supports dense PCB integration where board space and surface-mount assembly are important.

Unique Advantages

• High Logic Density: Approximately 444,343 logic elements enable large, integrated digital designs without external ASICs.
• Significant On-Chip RAM: Approximately 19.456 Mbits of embedded memory reduces dependence on external SDRAM for mid-sized buffering and storage tasks.
• Extensive I/O: 520 I/Os give flexibility to connect many peripherals, sensors, or high-channel-count interfaces directly to the FPGA.
• Compact FCBGA Package: 1156-FCBGA (35×35) provides a small footprint suitable for compact system boards while supporting surface-mount production.
• Commercial Temperature and RoHS Compliance: Designed for 0 °C to 85 °C operation and RoHS-compliant manufacturing requirements.

Why Choose XCKU035-1FFVA1156C?

The XCKU035-1FFVA1156C offers a balanced combination of logic capacity, embedded memory, and a high pin count in a compact 1156-FCBGA package, suitable for designs that demand reconfigurable digital processing and broad interface support within a commercial temperature range. As a member of the Kintex® UltraScale™ family from AMD, it provides a platform for scalable, hardware-configurable solutions where integration density and ample on-chip resources matter.

This device is well suited to engineering teams and procurement organizations seeking a RoHS-compliant FPGA that consolidates substantial logic, memory, and I/O capability into a single surface-mount package for controlled-environment applications.

Request a quote or submit a purchase inquiry to evaluate the XCKU035-1FFVA1156C for your next design.