XCKU035-2FBVA676E
| Part Description |
Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 19456000 444343 676-BBGA, FCBGA |
|---|---|
| Quantity | 1,746 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 312 | Voltage | 922 mV - 979 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 25391 | Number of Logic Elements/Cells | 444343 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of XCKU035-2FBVA676E – Kintex® UltraScale™ FPGA, 676-FCBGA, 444,343 logic elements
The XCKU035-2FBVA676E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 676-FCBGA package. The device combines a large logic fabric with on-chip memory and a substantial I/O count in a surface-mount 676-FCBGA (27×27) package.
Key device characteristics include 444,343 logic elements, approximately 19.456 Mbits of embedded memory, 312 I/Os, an extended-grade operating range of 0°C to 100°C, and a supply voltage window of 922 mV to 979 mV.
Key Features
- Core Architecture The device is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) optimized for a broad set of programmable logic applications.
- Logic Capacity 444,343 logic elements providing substantial programmable resources for complex digital designs.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM for buffering, state storage, and local data processing.
- I/O Count 312 general-purpose I/Os to support diverse interfacing and system integration needs.
- Package and Mounting 676-BBGA, FCBGA package in a 676-FCBGA (27×27) footprint, designed for surface-mount assembly.
- Power Supply Range Specified supply voltage range from 922 mV to 979 mV to guide power delivery design.
- Temperature and Grade Extended-grade device with an operating temperature range of 0°C to 100°C.
Unique Advantages
- Substantial programmable logic 444,343 logic elements enable complex combinational and sequential logic implementations without external ASICs.
- Significant on-chip memory Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage tasks.
- Ample I/O capacity 312 I/Os provide flexibility for multi-channel interfaces and mixed-signal board designs.
- Compact surface-mount package 676-FCBGA (27×27) offers a dense package footprint suitable for space-constrained boards while retaining a high pin count.
- Defined supply window The 922 mV–979 mV supply range gives clear boundaries for power-supply design and regulation.
- Extended-grade operation Rated for 0°C to 100°C operation to match systems requiring extended commercial temperature support.
Why Choose XCKU035-2FBVA676E?
The XCKU035-2FBVA676E positions itself as a feature-rich Kintex® UltraScale™ FPGA option when a design requires extensive logic resources, on-chip memory, and a large I/O complement in a compact surface-mount FCBGA package. Its specified supply voltage range and extended operating temperature make it suitable for systems that need clearly defined electrical and thermal envelopes.
This device is appropriate for engineering teams and procurement sourcing FPGA capacity where a combination of substantial logic elements, embedded RAM, and a high I/O count in a 676-FCBGA form factor are required.
Request a quote or submit an inquiry for XCKU035-2FBVA676E to receive pricing and availability information tailored to your project requirements.

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