XCKU035-2FBVA676E

IC FPGA 312 I/O 676FCBGA
Part Description

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 19456000 444343 676-BBGA, FCBGA

Quantity 1,746 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O312Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs25391Number of Logic Elements/Cells444343
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of XCKU035-2FBVA676E – Kintex® UltraScale™ FPGA, 676-FCBGA, 444,343 logic elements

The XCKU035-2FBVA676E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 676-FCBGA package. The device combines a large logic fabric with on-chip memory and a substantial I/O count in a surface-mount 676-FCBGA (27×27) package.

Key device characteristics include 444,343 logic elements, approximately 19.456 Mbits of embedded memory, 312 I/Os, an extended-grade operating range of 0°C to 100°C, and a supply voltage window of 922 mV to 979 mV.

Key Features

  • Core Architecture  The device is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) optimized for a broad set of programmable logic applications.
  • Logic Capacity  444,343 logic elements providing substantial programmable resources for complex digital designs.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, state storage, and local data processing.
  • I/O Count  312 general-purpose I/Os to support diverse interfacing and system integration needs.
  • Package and Mounting  676-BBGA, FCBGA package in a 676-FCBGA (27×27) footprint, designed for surface-mount assembly.
  • Power Supply Range  Specified supply voltage range from 922 mV to 979 mV to guide power delivery design.
  • Temperature and Grade  Extended-grade device with an operating temperature range of 0°C to 100°C.

Unique Advantages

  • Substantial programmable logic  444,343 logic elements enable complex combinational and sequential logic implementations without external ASICs.
  • Significant on-chip memory  Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage tasks.
  • Ample I/O capacity  312 I/Os provide flexibility for multi-channel interfaces and mixed-signal board designs.
  • Compact surface-mount package  676-FCBGA (27×27) offers a dense package footprint suitable for space-constrained boards while retaining a high pin count.
  • Defined supply window  The 922 mV–979 mV supply range gives clear boundaries for power-supply design and regulation.
  • Extended-grade operation  Rated for 0°C to 100°C operation to match systems requiring extended commercial temperature support.

Why Choose XCKU035-2FBVA676E?

The XCKU035-2FBVA676E positions itself as a feature-rich Kintex® UltraScale™ FPGA option when a design requires extensive logic resources, on-chip memory, and a large I/O complement in a compact surface-mount FCBGA package. Its specified supply voltage range and extended operating temperature make it suitable for systems that need clearly defined electrical and thermal envelopes.

This device is appropriate for engineering teams and procurement sourcing FPGA capacity where a combination of substantial logic elements, embedded RAM, and a high I/O count in a 676-FCBGA form factor are required.

Request a quote or submit an inquiry for XCKU035-2FBVA676E to receive pricing and availability information tailored to your project requirements.

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