XCKU040-1FBVA676C

The XCKU040-1FBVA676C is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD supplied in a 676-ball FCBGA package. It combines high logic capacity and sizeable on-chip RAM with a 312-pin I/O footprint and is supplied in a surface-mount FCBGA (27 × 27 mm) package.

This commercial-grade device is specified for single-supply operation in the 922 mV to 979 mV range and an ambient operating temperature of 0 °C to 85 °C, delivering reconfigurable logic resources and embedded memory for a range of system-level designs.

Key Features

• Logic Capacity  Approximately 530,250 logic elements to implement complex, reconfigurable digital logic and custom accelerators.
• Configurable Logic Blocks  Approximately 30,300 configurable logic blocks (CLBs) for flexible partitioning of logic and routing resources.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM to support buffering, large lookup tables, and memory-intensive functions.
• I/O Resources  312 user I/O pins, enabling broad interfacing options for high-pin-count systems and multi-channel designs.
• Power  Specified core supply range from 922 mV to 979 mV to match platform power domains and regulator targets.
• Package & Mounting  676-ball FCBGA (27 × 27 mm) package, surface mount, suitable for compact board layouts with high pin density.
• Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard embedded and computing applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Compute Acceleration  Implement custom data-paths and hardware accelerators where high logic density and embedded RAM improve throughput.
• Networking & Communications  Use the device’s plentiful I/O and reconfigurable logic to implement protocol processing, packet inspection, and interface bridging.
• Signal Processing  Leverage the large embedded memory and logic resources for real-time DSP, filtering, and multi-channel data handling.
• Prototyping & System Integration  Rapidly iterate system-level designs and integrate IP blocks on a single, high-capacity FPGA platform.

Unique Advantages

• High Logic Density: With roughly 530,250 logic elements, the device supports complex system integration on a single FPGA.
• Substantial On-Chip Memory: Approximately 21.6 Mbits of embedded RAM reduces the need for external memory in many buffering and streaming use cases.
• Generous I/O Count: 312 user I/Os provide flexibility for multi-protocol interfaces, parallel data lanes, and high-pin-count peripherals.
• Compact, High-Pin Package: The 676-FCBGA (27 × 27 mm) footprint balances board space efficiency with dense pin access for system routing.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet standard embedded and computing environment requirements.
• Regulatory-Friendly: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCKU040-1FBVA676C?

The XCKU040-1FBVA676C provides a balanced combination of high logic element count, substantial embedded memory, and a high I/O complement in a compact FCBGA package. This balance makes it well suited to system designs that require significant on-chip processing, buffering, and interface density without expanding board area.

Manufactured by AMD and offered as a commercial-grade FPGA, this part is appropriate for engineering teams and procurement seeking a reconfigurable platform for compute acceleration, signal processing, communications, and advanced prototyping where on-chip capacity and I/O flexibility are primary selection criteria.

Request a quote or submit a parts inquiry for the XCKU040-1FBVA676C to check availability and pricing for your design requirements.