XCAU25P-2SFVB784I

The XCAU25P-2SFVB784I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) from AMD, supplied in a 784-BFBGA / 784‑FCBGA (23×23) surface-mount package. It provides a large pool of programmable logic, on-chip memory and I/O count suitable for industrial applications that require substantial logic capacity and broad connectivity.

This device combines 308,437 logic elements with approximately 4.9 Mbits of embedded RAM and 304 I/O, and operates across an industrial temperature range with a defined supply voltage window, enabling deployment in temperature-sensitive embedded and control systems.

Key Features

• Programmable Logic Capacity — 308,437 logic elements provide a high-density fabric for implementing complex digital logic and custom accelerators.
• Embedded Memory — Total on-chip RAM of approximately 4.9 Mbits supports buffering, tables and local data storage for FPGA designs.
• I/O Resources — 304 general-purpose I/O pins enable extensive external connectivity for sensors, peripherals and parallel interfaces.
• Power Supply Range — Defined voltage supply window from 825 mV to 876 mV to match system power-rail requirements.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package and Mounting — 784‑FBGA (784‑FCBGA) 23×23 package with surface-mount mounting type for high-density board integration.
• Regulatory — RoHS compliant for environmental regulation conformance.

Typical Applications

• Industrial Control Systems — Use the device’s 308,437 logic elements and industrial temperature rating to implement control logic, sequencing and real-time decision functions in industrial automation equipment.
• High-density Embedded Processing — Approximately 4.9 Mbits of embedded RAM combined with large logic capacity supports on-chip buffering and custom processing blocks for embedded applications.
• I/O-Intensive Interfaces — 304 I/O pins provide the connectivity needed for multi-channel data acquisition, peripheral aggregation or complex interface bridging in embedded systems.

Unique Advantages

• Substantial Logic Resources: 308,437 logic elements enable integration of large custom logic designs into a single device, reducing external component count.
• On-chip Memory: Approximately 4.9 Mbits of embedded RAM allows designers to keep data local to the FPGA fabric for lower-latency operations.
• Wide I/O Count: 304 I/O pins support extensive device interconnect without resorting to external expansion logic.
• Industrial Temperature Support: −40 °C to 100 °C operating range lets designs remain operational in demanding thermal environments.
• Compact BGA Package: 784‑FCBGA (23×23) surface-mount package supports high-density PCB layouts and automated assembly.
• Regulatory Compliance: RoHS compliance simplifies environmental compliance for manufactured products.

Why Choose XCAU25P-2SFVB784I?

The XCAU25P-2SFVB784I positions itself as an industrial-grade Artix® UltraScale+ FPGA option for designs that demand a balance of large programmable logic, embedded memory and significant I/O capacity in a compact BGA package. Its defined supply voltage window and industrial operating temperature range make it suitable for robust embedded and control applications.

Engineers and procurement teams looking for a high-density, industrial FPGA from AMD will find this part appropriate for consolidating functionality onto a single device, reducing board-level complexity while supporting demanding I/O and memory needs.

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