XCKU040-1FFVA1156I

The XCKU040-1FFVA1156I is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD, packaged in a 1156-FCBGA (35×35) surface-mount package. It delivers a large fabric of programmable logic and embedded memory suitable for designs that require significant on‑chip resources and high I/O counts.

With 530,250 logic elements, approximately 21.606 Mbits of embedded memory, and 520 I/O pins, this industrial‑grade device targets applications that need substantial integration of logic, memory, and peripheral connectivity within a single FPGA footprint.

Key Features

• Programmable Logic Capacity — Contains 530,250 logic elements organized across 30,300 CLBs to implement complex digital logic and custom accelerators.
• Embedded Memory — Total on‑chip RAM of 21,606,000 bits (approximately 21.606 Mbits) for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Density — 520 I/O pins to support extensive peripheral connectivity and multiple high‑pin-count interfaces.
• Package — 1156-BBGA / 1156-FCBGA (35×35) supplier device package designed for surface-mount PCB assembly.
• Power Supply Range — Core supply operating range specified at 922 mV to 979 mV for the device core domain.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C to meet a broad set of environmental conditions.
• Mounting — Surface-mount assembly suitable for standard PCB manufacturing processes.

Typical Applications

• High‑density digital processing — Use the large logic element count and CLB resources to implement SIMD datapaths, custom state machines, and protocol processing within a single device.
• Memory‑rich buffering — Leverage approximately 21.606 Mbits of embedded memory for frame buffers, packet queues, or large on‑chip FIFOs.
• Multi‑interface systems — The 520 I/O pins support designs that require numerous external connections, sensor interfaces, or parallel data buses.

Unique Advantages

• Substantial logic fabric: 530,250 logic elements and 30,300 CLBs offer the scale needed to merge multiple functions onto one FPGA, reducing board-level component count.
• Significant on‑chip memory: Approximately 21.606 Mbits of embedded RAM allow designers to implement large buffers and state storage without external memory for many use cases.
• High I/O capacity: 520 available I/O pins enable complex interconnections and support for multiple parallel interfaces or sensors from a single package.
• Industrial temperature range: Rated from -40 °C to 100 °C to address applications that operate across wide ambient conditions.
• Standard surface‑mount package: The 1156-FCBGA (35×35) package supports established PCB assembly processes and dense board layouts.

Why Choose XCKU040-1FFVA1156I?

The XCKU040-1FFVA1156I positions itself as a high‑capacity Kintex® UltraScale™ FPGA option for engineers who need a balance of logic, embedded memory, and abundant I/O in a single industrial‑grade, surface‑mount package. Its combination of 530,250 logic elements, approximately 21.606 Mbits of on‑chip RAM, and 520 I/O makes it suitable for consolidating multiple functional blocks and reducing system BOM complexity.

Designed for customers developing complex digital systems, the device provides a scalable hardware platform for prototyping and deployment where ample programmable resources and a broad operating temperature range are required.

Request a quote or submit your design requirements to receive pricing and availability for the XCKU040-1FFVA1156I.