XCKU040-2FBVA676I

The XCKU040-2FBVA676I is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD presented in a 676-ball FCBGA package. It delivers a combination of substantial logic capacity, embedded memory and I/O density targeted at industrial applications that require programmable, reconfigurable logic within a surface-mount 27 × 27 mm package.

With 530,250 logic elements and approximately 21.6 Mbits of embedded memory, this device is intended for designs that need significant on-chip resources while operating across a wide industrial temperature range and a defined core supply range.

Key Features

• Core Logic  Provides 530,250 logic elements to support complex digital designs and high-density logic integration.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM for buffering, state storage and lookup tables within the FPGA fabric.
• I/O Capacity  312 user I/O pins to interface with sensors, peripherals, transceivers and external devices.
• Package and Mounting  676-FCBGA (27 × 27 mm) package designed for surface-mount assembly, suitable for compact PCB layouts.
• Power  Core supply defined in the range 922 mV to 979 mV to match system power-rail planning and power sequencing requirements.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, enabling deployment in a variety of controlled and industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Use the device’s logic capacity and I/O count for programmable control, sensor interfacing and protocol bridging in industrial systems.
• Communications Infrastructure  Deploy as part of network equipment where significant on-chip logic and memory are needed for packet processing or protocol implementation.
• Test & Measurement  Leverage the FPGA’s embedded memory and I/Os for data capture, preprocessing and custom measurement logic.
• Prototyping and High-Density Logic  Suitable for validation platforms and designs that require a large pool of logic elements and memory for algorithm development.

Unique Advantages

• High logic capacity: 530,250 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• Significant on-chip memory: Approximately 21.6 Mbits of embedded RAM supports buffering and local data storage without immediate need for external memory.
• Substantial I/O density: 312 I/Os provide flexible interfacing options for peripherals, sensors and communication links.
• Industrial operating range: Rated from −40 °C to 100 °C to support deployments in industrial temperature environments.
• Compact surface-mount package: 676-FCBGA (27 × 27 mm) enables space-efficient PCB designs while delivering high integration.
• RoHS compliant: Conforms to RoHS requirements for reduced hazardous substances.

Why Choose XCKU040-2FBVA676I?

The XCKU040-2FBVA676I combines the Kintex UltraScale FPGA architecture with a large pool of logic elements, substantial embedded memory and a high I/O count in a compact 676-FCBGA surface-mount package. Its defined core supply range and industrial operating temperature rating make it a practical choice for engineers deploying robust, reconfigurable logic in industrial and infrastructure applications.

Designed for teams that require scalable on-chip resources and reliable operation across a wide temperature range, this AMD FPGA offers a balance of integration and capability for medium- to high-density programmable designs.

Request a quote or submit a purchase inquiry to get pricing and availability for the XCKU040-2FBVA676I.