XCKU040-2FBVA676E

The XCKU040-2FBVA676E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 676-ball FCBGA package. It combines a high count of programmable logic cells and on-chip RAM with a 312-pin I/O footprint in a 27×27 mm package for board-level integration.

This device targets designs that require substantial programmable logic capacity and embedded memory while maintaining a compact surface-mount package and extended operating temperature range.

Key Features

• Logic Capacity  530,250 logic elements (logic cells) provide significant programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM to support buffers, FIFOs, and storage for high-throughput logic functions.
• I/O Count  312 user I/Os for extensive connectivity to peripherals, serializers, and board-level interfaces.
• Package  676-BBGA, FCBGA package (supplier device package: 676-FCBGA, 27×27 mm) for a high-pin-count, compact footprint suitable for surface-mount assembly.
• Power  Specified voltage supply range of 922 mV to 979 mV to match system power-rail planning and regulator selection.
• Thermal and Mounting  Surface mount device with an extended grade operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant for environmental and assembly considerations.

Typical Applications

• High-density digital processing  Use the device’s large logic capacity and on-chip RAM for custom signal processing pipelines and protocol handling.
• Interface aggregation  Leverage 312 I/Os to consolidate multiple board-level interfaces and translate or route signals between subsystems.
• Hardware prototyping and custom logic  Deploy the FPGA for proof-of-concept designs or to implement application-specific accelerators before ASIC commitment.

Unique Advantages

• High logic integration: 530,250 logic elements enable complex state machines, datapaths, and parallel processing within a single device.
• Substantial on-chip memory: Approximately 21.6 Mbits of embedded RAM reduce external memory dependence for many buffering and storage tasks.
• Compact, high-pin-count package: The 676-FCBGA (27×27 mm) package balances pin density and board area for space-constrained designs.
• Wide I/O capability: 312 I/Os give flexibility for multi-channel and multi-protocol system designs without immediate need for external GPIO expanders.
• Design-ready power range: Defined voltage supply range (922 mV–979 mV) assists in power-supply selection and thermal planning.
• RoHS compliant: Supports environmentally compliant manufacturing and assembly processes.

Why Choose XCKU040-2FBVA676E?

The XCKU040-2FBVA676E delivers a balance of high logic density, considerable embedded memory, and a large I/O count in a compact surface-mount FCBGA package. Its extended operating temperature range and defined supply window make it suitable for a broad set of board-level programmable logic applications.

This FPGA is well suited for engineers and teams that need scalable programmable logic and on-chip RAM within a 676-ball package, enabling system consolidation and reduced external component count while supporting detailed power and thermal planning.

Request a quote or submit a pricing inquiry to start integrating the XCKU040-2FBVA676E into your design and to obtain availability and lead-time details.