XCKU040-1SFVA784I

The XCKU040-1SFVA784I is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD supplied in a 784-BFBGA FCCSP package. It provides a large programmable fabric, substantial embedded memory, and a high I/O count targeted at industrial applications that require configurable logic and robust operating conditions.

This device combines approximately 530,250 logic elements with approximately 21.6 Mbits of on-chip RAM and 468 I/O in a surface-mount 784-FCCSPBGA (23×23) package, supporting designs that need dense integration, significant memory resources, and broad interfacing capability within an industrial temperature range.

Key Features

• Core Logic  Approximately 530,250 logic elements and 30,300 CLBs provide a large programmable fabric for complex logic implementation.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM for buffering, state storage, and algorithmic data requirements.
• I/O Capacity  468 user I/O pins to support dense external interfacing and multi-channel connectivity.
• Package and Mounting  784-BFBGA, FCCSP package (supplier package: 784-FCCSPBGA (23×23)) designed for surface-mount assembly and compact board integration.
• Power Supply  Operates from a supply range of 922 mV to 979 mV as specified for the device core supply domain.
• Temperature and Grade  Industrial grade qualification with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• Industrial Control Systems  Programmable logic and wide operating temperature range enable motor control, PLC modules, and factory automation controllers.
• Signal Processing  Large logic capacity and embedded RAM support data buffering and on-device algorithm implementation for real-time processing tasks.
• High-Density I/O Systems  Extensive I/O count allows integration with multiple sensors, peripherals, or parallel interfaces in compact system boards.
• Embedded System Integration  Compact 784-FCCSPBGA package and surface-mount mounting suit space-constrained designs requiring programmable logic close to other system components.

Unique Advantages

• High Integration Density: Approximately 530,250 logic elements consolidate complex functions onto a single device, reducing external component count.
• Significant On-Chip Memory: Approximately 21.6 Mbits of embedded RAM supports large buffers and state storage without relying on external memory.
• Broad External Connectivity: 468 I/O pins provide flexibility for interfacing many channels or mixed-signal peripherals directly to the FPGA.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in environments that demand extended temperature tolerance.
• Compact Surface-Mount Package: 784-FCCSPBGA (23×23) footprint enables high-density board layouts while maintaining a high-pin-count interface.
• RoHS Compliant: Meets common environmental compliance requirements for many industrial and commercial applications.

Why Choose XCKU040-1SFVA784I?

The XCKU040-1SFVA784I positions itself as a highly integrated FPGA solution for industrial systems needing substantial logic resources, embedded memory, and a large number of I/Os in a compact surface-mount package. Its specified core voltage range and industrial temperature rating make it suitable for designs that require stable operation across a wide set of conditions.

Engineers and procurement teams building mid-to-high complexity programmable systems will find this device useful where consolidation of logic, on-chip memory, and extensive interfacing reduce BOM complexity and support scalable, maintainable designs backed by the Kintex UltraScale family.

Request a quote or submit a sales inquiry for part number XCKU040-1SFVA784I to check availability and receive pricing and lead-time information.