XCKU040-2SFVA784E

The XCKU040-2SFVA784E is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD. It provides a high logic-density FPGA fabric with a broad complement of on-chip memory and I/O, packaged in a 784-ball BFBGA / FCCSP footprint for surface-mount applications.

Targeted at designs that require substantial logic resources, embedded memory and large I/O counts, this device supports applications where integration, deterministic temperature operation and RoHS compliance are important considerations.

Key Features

• Core Logic  Approximately 530,250 logic elements available for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM for buffers, FIFOs and intermediate data storage.
• I/O Capacity  468 general-purpose I/O pins to support multiple interfaces and parallel connections.
• Voltage Supply  Operates with a supply range of 922 mV to 979 mV as specified for device core operation.
• Package Options  Available in a 784-BFBGA, FCCSP package; supplier device package listed as 784-FCCSPBGA (23×23) to suit high-density board designs.
• Mounting & RoHS  Surface-mount device that is RoHS compliant for lead-free manufacturing flows.
• Operating Temperature & Grade  Extended-grade device rated for 0 °C to 100 °C operating temperature.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded memory to implement complex data-paths, signal processing pipelines and custom accelerators.
• Communications equipment  Leverage the high I/O count for interface aggregation, protocol bridging and packet processing functions.
• Data acquisition and instrumentation  On-chip RAM and abundant logic enable buffering, real-time control and data formatting in test and measurement systems.

Unique Advantages

• Large logic capacity: 530,250 logic elements provide the headroom needed for complex FPGA designs without immediate migration to larger families.
• Substantial embedded memory: Approximately 21.6 Mbits of on-chip RAM minimizes external memory requirements for many buffering and caching applications.
• High I/O density: 468 I/O pins allow flexible interfacing to multiple parallel and serial peripherals.
• Compact, manufacturable package: 784-ball BFBGA / FCCSP (784-FCCSPBGA 23×23) supports high-density PCB layouts and surface-mount assembly processes.
• Extended operating range: Rated 0 °C to 100 °C to meet temperature requirements for a range of commercial and industrial environments.
• RoHS compliant: Supports lead-free manufacturing and environmental compliance needs.

Why Choose XCKU040-2SFVA784E?

The XCKU040-2SFVA784E balances a high count of logic elements and significant on-chip RAM with a large I/O complement in a compact surface-mount package. Its specifications make it well suited to designs that need substantial programmable logic and embedded memory while maintaining a manufacturable form factor and RoHS compliance.

This device is appropriate for engineering teams building complex digital systems—particularly where integration, I/O flexibility and a defined operating temperature range are priority considerations. The combination of logic, memory and packaging supports scalable design choices and long-term deployment in applicable environments.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XCKU040-2SFVA784E.