XCKU040-2SFVA784I

The XCKU040-2SFVA784I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 784‑BFBGA FCCSP package. It provides a high-capacity programmable logic platform with a large on-chip memory footprint and a substantial I/O complement for industrial-grade deployments.

Key value comes from its logic and memory density—530,250 logic elements and approximately 21.6 Mbits of embedded memory—combined with a 468-pin I/O count and a surface-mount 784‑BFBGA package. The device operates across a wide industrial temperature range and supports low-voltage supply rails as specified.

Key Features

• Logic Capacity  530,250 logic elements provide significant programmable compute resources for complex digital designs.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM to support buffering, data processing, and state storage.
• I/O Density  468 I/O pins allow extensive external interfacing for multi-channel systems and high-connectivity designs.
• Package & Mounting  784‑BFBGA, FCCSP package (supplier device package: 784‑FCCSPBGA 23×23) in a surface-mount form factor for board-level integration.
• Power Supply Range  Specified operating core supply range from 922 mV to 979 mV to match target system power architectures.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to address industrial environmental requirements.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High integration  Large logic and memory resources reduce the need for external components and simplify system-level design.
• Extensive external connectivity  468 I/Os enable multi-channel interfacing and flexible pinout assignments for diverse peripheral integration.
• Compact, board-ready package  The 784‑BFBGA FCCSP package delivers high pin density in a surface-mount form factor suitable for compact PCBs.
• Industrial robustness  Rated for −40 °C to 100 °C operation to meet demanding industrial thermal environments.
• Targeted power envelope  Defined core supply window (922 mV–979 mV) supports predictable integration with system power supplies.
• Standards-aware manufacturing  RoHS compliance supports regulatory alignment for production and deployment.

Why Choose XCKU040-2SFVA784I?

The XCKU040-2SFVA784I positions itself as a high-capacity Kintex UltraScale FPGA option for industrial applications requiring substantial programmable logic, on-chip memory, and many external I/Os. Its combination of 530,250 logic elements, approximately 21.6 Mbits of embedded RAM, and 468 I/Os provides designers with a balanced platform for data‑intensive and highly connected systems.

Packaged in a 784‑BFBGA FCCSP surface-mount form with an industrial temperature rating and RoHS compliance, this device is suited for engineers seeking a robust, scalable building block that aligns with AMD’s Kintex UltraScale architecture and industrial deployment needs.

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