XCKU040-3FFVA1156E

The XCKU040-3FFVA1156E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD, provided in a 1156-FCBGA (35×35) surface-mount package. It combines a large logic fabric with substantial embedded memory and a high I/O count to address designs that require many programmable logic resources and on-chip storage.

With approximately 530,250 logic elements, roughly 21.6 Mbits of embedded RAM, and 520 user I/Os, this device is positioned for dense digital implementations where integration of logic, memory, and I/O capacity reduces board-level complexity.

Key Features

• Logic Capacity  Approximately 530,250 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM for buffering, FIFOs, and state storage.
• High I/O Count  520 user I/Os to support wide parallel interfaces and numerous external peripherals.
• Power Supply  Core voltage operating range of 970 mV to 1.03 V for supply planning and power sequencing.
• Package & Mounting  1156-FCBGA (35×35) package, 1156-BBGA case option; surface-mount mounting for compact board integration.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant for regulatory and assembly considerations.

Typical Applications

• High-density digital systems  Large-scale logic implementations that require hundreds of thousands of logic elements and significant on-chip RAM.
• I/O-intensive interfaces  Designs needing broad parallel connectivity or multiple peripheral channels supported by 520 user I/Os.
• Embedded memory-dependent designs  Applications that rely on substantial on-chip RAM for buffering, packet storage, or local data processing.

Unique Advantages

• Substantial logic resources: Approximately 530,250 logic elements enable implementation of complex algorithms and large state machines on a single device.
• On-chip memory capacity: Roughly 21.6 Mbits of embedded RAM reduces dependence on external memory and lowers board-level BOM.
• Extensive I/O capability: 520 user I/Os provide flexibility for high-pin-count interfaces and parallel data paths.
• Compact, surface-mount packaging: 1156-FCBGA (35×35) package supports dense PCB layouts while maintaining a high resource count.
• Controlled supply requirements: A defined core voltage range (970 mV–1.03 V) simplifies power rail design and sequencing considerations.
• Regulatory readiness: RoHS compliance supports lead-free assembly processes.

Why Choose XCKU040-3FFVA1156E?

The XCKU040-3FFVA1156E delivers a combination of large logic capacity, considerable embedded memory, and a high I/O count in a single surface-mount FPGA package. Its extended-grade operating range and defined core voltage make it suitable for designs that need significant on-chip resources while maintaining compact board-level integration.

This device is appropriate for development teams and system designers targeting complex digital functions where consolidating logic, memory, and I/O on one FPGA reduces component count and simplifies system architecture.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the XCKU040-3FFVA1156E.