XCKU040-L1SFVA784I

The XCKU040-L1SFVA784I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 784-BFBGA / FCCSP package. It provides a high density of programmable logic and embedded memory in a surface-mount package targeted for industrial applications requiring robust operation across a wide temperature range.

With hundreds of user I/Os, a large pool of logic elements and on-chip RAM, this device suits designs that demand substantial parallel processing, complex control logic, and dense I/O interfacing while operating at low core voltages.

Key Features

• Logic Capacity – Approximately 530,250 logic elements, enabling large-scale programmable logic implementations and complex digital algorithms.
• Configurable Logic Blocks – High logical resource count for partitioning functions and implementing parallel datapaths.
• Embedded Memory – Approximately 21.6 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Density – 468 user I/Os to support broad peripheral and bus interfacing requirements.
• Package & Mounting – 784-BFBGA, FCCSP package; supplier device package listed as 784-FCCSPBGA (23x23). Surface-mount device for PCB integration.
• Power – Core supply range from 880 mV to 979 mV for low-voltage operation.
• Industrial Temperature Range – Rated for operation from -40°C to 100°C to meet demanding environmental conditions.
• Manufacturer – Produced by AMD, providing a recognizable supplier pedigree.

Typical Applications

• Industrial Control and Automation – Implements complex control logic and state machines while withstanding industrial temperature ranges.
• High-Density I/O Systems – Interfaces numerous sensors, actuators, and parallel buses using its 468 user I/Os.
• Signal Processing and Data Aggregation – Uses large logic capacity and ~21.6 Mbits of embedded memory for buffering and parallel processing pipelines.
• Embedded System Prototyping – Provides ample logic and memory resources for validating hardware accelerators and custom controllers.

Unique Advantages

• High Logic Density: Approximately 530,250 logic elements allow integration of complex functions that reduce external component count.
• Substantial Embedded Memory: Around 21.6 Mbits of on-chip RAM supports local data storage, reducing reliance on off-chip memory.
• Extensive I/O Capability: 468 user I/Os enable broad connectivity to peripherals, buses and sensors in dense system designs.
• Industrial Reliability: Rated for -40°C to 100°C operation, suitable for harsh environmental deployments.
• Compact, Surface-Mount Packaging: 784-BFBGA / 784-FCCSPBGA (23x23) package balances density and board-level integration for space-constrained designs.
• Low-Voltage Core Operation: 880 mV to 979 mV supply range supports modern low-power system architectures.

Why Choose XCKU040-L1SFVA784I?

The XCKU040-L1SFVA784I positions itself as a high-capacity, industrial-grade FPGA choice for designers who need significant programmable logic, ample embedded memory and a large I/O footprint in a compact surface-mount package. Its electrical and thermal specifications are targeted at robust, long-lived deployments where environmental tolerance and high integration matter.

Ideal for engineers developing industrial control, signal processing, and complex I/O systems, this AMD Kintex® UltraScale™ device provides the resources to consolidate functions, reduce BOM complexity, and scale designs as requirements evolve.

If you would like pricing or availability information, request a quote or submit an RFQ detailing quantities and delivery requirements to receive a prompt response.