XCKU060-1FFVA1156C

The XCKU060-1FFVA1156C is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD. It provides a high logic capacity FPGA fabric with substantial embedded memory and a large number of I/O pins in a 1156-FCBGA surface-mount package. This device is suited to designs that require dense logic resources, significant on-chip RAM, and flexible I/O connectivity within a commercial temperature range.

Key Features

• FPGA Core  Kintex® UltraScale™ family FPGA architecture in the XCKU060 device class.
• Logic Capacity  Approximately 725,550 logic elements for implementing large, complex digital designs.
• Embedded Memory  Approximately 38.9 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate storage.
• I/O Resources  520 user I/O pins to interface with external peripherals, sensors, and high-pin-count systems.
• Package & Mounting  1156-FCBGA (35 × 35 mm) ball-grid array in a surface-mount form factor for board-level integration.
• Supply Voltage  Operates from 922 mV to 979 mV supply range as specified for this device.
• Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C ambient operation.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Implement complex algorithms and data paths using the device’s ~725,550 logic elements and substantial embedded memory.
• Multi-channel I/O systems  Leverage 520 I/O pins for designs requiring numerous external interfaces or wide parallel data buses.
• Prototyping and system integration  Use the 1156-FCBGA surface-mount package for board-level prototypes and integrated subsystem designs within a commercial temperature range.

Unique Advantages

• High logic density: Approximately 725,550 logic elements enable consolidation of large functions into a single device, reducing overall system complexity.
• Significant embedded memory: ~38.9 Mbits of on-chip RAM supports buffering and data-intensive operations without immediate external memory reliance.
• Large I/O count: 520 I/O pins simplify connectivity for multi-channel and high-pin-count applications, minimizing the need for external multiplexing.
• Compact surface-mount package: 1156-FCBGA (35 × 35 mm) facilitates high-density PCB layouts while providing robust soldered attachment for production boards.
• Commercial temperature grading: Specified operation from 0 °C to 85 °C for deployments in standard commercial environments.
• Regulatory compliance: RoHS compliant for lead-free manufacturing requirements.

Why Choose XCKU060-1FFVA1156C?

The XCKU060-1FFVA1156C balances substantial logic capacity, considerable embedded RAM, and a high I/O count in a compact 1156-FCBGA surface-mount package. Its supply voltage range and commercial operating temperature make it appropriate for a wide range of board-level FPGA designs where consolidation of functionality and high-density interfacing are priorities.

This device is well suited for engineering teams and procurement focused on scalable FPGA implementations that require strong on-chip resources, flexible I/O, and RoHS-compliant construction backed by the Kintex UltraScale family platform.

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