XCKU060-1FFVA1517C

IC FPGA 624 I/O 1517FCBGA
Part Description

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 624 38912000 725550 1517-BBGA, FCBGA

Quantity 941 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O624Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs41460Number of Logic Elements/Cells725550
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits38912000

Overview of XCKU060-1FFVA1517C – Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC, 1517-FCBGA

The XCKU060-1FFVA1517C is a Kintex® UltraScale™ FPGA from AMD, provided in a 1517-BBGA FCBGA package (1517-FCBGA, 40×40) and intended for commercial-grade surface-mount applications. It delivers high logic capacity with 725,550 logic elements and 41,460 configurable logic blocks (CLBs), together with approximately 38.9 Mbits of on-chip RAM and 624 user I/O.

This device is specified for operation from 0 °C to 85 °C with a supply voltage range of 922 mV to 979 mV and is RoHS compliant, making it suitable for commercial electronic designs that require substantial programmable logic, embedded memory, and dense I/O in a compact FCBGA form factor.

Key Features

  • Logic Capacity 725,550 logic elements and 41,460 configurable logic blocks (CLBs) for implementing complex digital functions and large FPGA designs.
  • Embedded Memory Approximately 38.9 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without relying on external memory.
  • I/O Density 624 user I/O pins to accommodate multiple high-pin-count interfaces and peripheral connections.
  • Power Supply Range Specified supply voltage from 922 mV to 979 mV for the device core.
  • Package and Mounting 1517-BBGA (1517-FCBGA, 40×40) in a surface-mount package to enable a compact board footprint and high pin density.
  • Temperature and Grade Commercial grade with operating temperature from 0 °C to 85 °C for standard commercial environments.
  • Regulatory RoHS compliant.

Unique Advantages

  • High integration density: 725,550 logic elements and 41,460 CLBs reduce the need for multiple devices by consolidating logic on a single FPGA.
  • Substantial on-chip memory: Approximately 38.9 Mbits of embedded RAM supports large data buffers and complex state machines without immediate reliance on external DRAM.
  • Extensive I/O capability: 624 user I/O pins enable connectivity to many peripherals and parallel interfaces from one device.
  • Compact FCBGA package: 1517-FCBGA (40×40) offers high pin count in a space-efficient surface-mount package for dense board designs.
  • Commercial-grade operating range: Rated 0 °C to 85 °C to match standard commercial deployment environments.
  • RoHS compliant: Aligns with common environmental and regulatory requirements for commercial electronics.

Why Choose XCKU060-1FFVA1517C?

The XCKU060-1FFVA1517C delivers a balanced combination of large logic capacity, significant embedded memory, and high I/O density in a compact 1517-FCBGA surface-mount package. As a Kintex® UltraScale™ device from AMD, it is positioned for commercial designs that require substantial programmable resources and dense connectivity within a constrained board footprint.

This FPGA is well suited for development teams and procurement organizations seeking a commercial-grade, RoHS-compliant programmable device with defined supply and temperature specifications, offering scalability for complex digital designs that need integrated memory and high I/O counts.

If you would like pricing, availability, or to request a formal quote for the XCKU060-1FFVA1517C, please submit a quote request or contact our sales channel for further assistance.

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