XCKU040-3FBVA676E

The XCKU040-3FBVA676E is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD. It delivers a high-density programmable-logic fabric combined with significant on-chip memory and a broad I/O count to support complex digital designs.

Designed for applications that require large logic capacity, embedded memory, and flexible interfacing, this device offers an Extended-grade FCBGA package and a core voltage range suitable for UltraScale power domains.

Key Features

• Logic Capacity — 530,250 logic cells provide substantial programmable logic resources for complex state machines, datapaths, and custom accelerators.
• Configurable Logic Blocks — 30,300 CLB-like resources (reported as labs/clbs) to structure logic implementation and partition larger designs.
• Embedded Memory — Approximately 21.6 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without immediate dependence on external memory.
• I/O Density — 312 user I/O pins for broad peripheral, interface, and mezzanine connectivity options.
• Power Domain — Core supply range of 0.970 V to 1.030 V, consistent with UltraScale core voltage requirements.
• Package & Mounting — 676-ball FCBGA (676-BBGA) in a 27 × 27 mm supplier package; surface-mount mounting for compact board integration.
• Temperature Grade — Extended operating range of 0 °C to 100 °C for thermal environments beyond standard commercial ranges.
• Environmental Compliance — RoHS-compliant construction.

Typical Applications

• High-density digital processing — Use the 530,250 logic cells and ~21.6 Mbits of embedded memory to implement complex signal-processing and parallel compute functions.
• Interface aggregation — 312 I/O pins enable integration of multiple serial and parallel interfaces for protocol bridging and system-level glue logic.
• Custom accelerator implementation — On-chip RAM and dense logic resources support hardware accelerators and offload tasks from host processors.
• Prototyping and system validation — Compact FCBGA packaging and surface-mount mounting make the device suitable for board-level prototypes and deployment-ready designs.

Unique Advantages

• High logic density: 530,250 logic cells allow large designs to be implemented on a single device, reducing system complexity.
• Significant on-chip memory: Approximately 21.6 Mbits of embedded RAM reduces reliance on external memory and lowers BOM cost for buffer-intensive functions.
• Generous I/O count: 312 I/O pins provide flexibility for connecting sensors, transceivers, and peripherals without additional interface chips.
• Compact FCBGA package: 676-ball, 27 × 27 mm footprint supports high-density board layouts while providing thermal and mechanical stability.
• Extended thermal grade: 0 °C to 100 °C operating range supports deployments in environments that require wider-than-standard temperature tolerance.
• RoHS compliant: Environmentally compliant manufacturing supports regulatory and procurement requirements.

Why Choose XCKU040-3FBVA676E?

The XCKU040-3FBVA676E positions itself for designs that demand a balance of large programmable logic capacity, substantial embedded memory, and flexible I/O in a compact FCBGA package. Its Extended-grade temperature range and RoHS compliance make it suitable for applications where wider operating temperatures and environmental compliance are important considerations.

Engineers and procurement teams seeking a scalable FPGA resource for complex digital processing, custom accelerators, or high-density interfacing will find this device offers an integrated solution that can reduce board-level complexity and support feature-rich systems.

Request a quote or submit an inquiry to obtain pricing and availability for the XCKU040-3FBVA676E.