XCKU085-3FLVB1760E

The XCKU085-3FLVB1760E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 1760-BBGA / 1760-FCBGA package. It provides a large set of programmable logic resources and on-chip memory suitable for demanding digital designs.

This device combines 1,088,325 logic elements, approximately 58.3 Mbits of embedded memory, and 676 I/O pins in a surface-mount 1760-FCBGA (42.5x42.5) package. The part operates from a core supply range of 970 mV to 1.03 V and is specified for 0 °C to 100 °C operation; it is supplied in Extended grade and is RoHS compliant.

Key Features

• Core Logic 1,088,325 logic elements provide extensive programmable logic capacity for complex FPGA designs.
• Embedded Memory Approximately 58.3 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Density & Package 676 user I/Os delivered in a 1760-BBGA / 1760-FCBGA package; supplier package noted as 1760-FCBGA (42.5x42.5). The device is surface-mount for board-level integration.
• Power Core supply voltage range from 970 mV to 1.03 V to match system power requirements.
• Temperature & Grade Specified for operation from 0 °C to 100 °C and offered in Extended grade for broader operating needs.
• Compliance RoHS compliant to meet environmental and regulatory requirements.

Unique Advantages

• High logic capacity: 1,088,325 logic elements enable integration of large, complex designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 58.3 Mbits of embedded RAM reduces dependency on external memory for buffering and local data storage.
• Extensive I/O count: 676 I/Os support high pin-count interfaces and dense connectivity for system-level integration.
• Compact, board-ready package: 1760-FCBGA (42.5x42.5) surface-mount packaging simplifies assembly for compact, high-density PCBs.
• Controlled core voltage: A defined supply range of 970 mV to 1.03 V supports predictable power planning and supply design.
• Extended temperature operation: Rated from 0 °C to 100 °C to cover a wide range of deployment environments.

Why Choose XCKU085-3FLVB1760E?

The XCKU085-3FLVB1760E positions itself as a high-capacity Kintex® UltraScale™ FPGA option that combines a very large logic element count, substantial embedded memory, and a high I/O count in a single 1760-FCBGA package. Its specifications make it suitable for designers who need high integration density and predictable power and thermal envelopes.

Manufactured by AMD and provided as an Extended-grade, RoHS-compliant device, this FPGA is appropriate for projects that require scalability of logic and memory resources while maintaining a compact, surface-mount form factor.

Request a quote or submit your requirements today to receive pricing and availability for the XCKU085-3FLVB1760E.