XCKU095-1FFVB1760C

The XCKU095-1FFVB1760C is a Kintex® UltraScale™ FPGA from AMD, delivered in a 1760-ball FCBGA package. It provides a high logic capacity and dense I/O in a surface-mount FCBGA footprint for commercial-temperature applications.

With 1,176,000 logic elements, approximately 60.5 Mbits of embedded memory and 702 I/O pins, this device is engineered for designs that require significant on-chip logic, embedded RAM and large I/O counts within a compact 42.5 × 42.5 mm package.

Key Features

• Core Logic  1,176,000 logic elements to support complex digital designs and large-scale logic integration.
• Embedded Memory  Approximately 60.5 Mbits of on-chip RAM for buffering, look-up tables and data storage close to logic.
• I/O Capacity  702 user I/O pins to support dense interfacing and multiple high-pin-count peripherals.
• Power Supply  Operates from a core voltage range of 922 mV to 979 mV, allowing precise power planning for core domains.
• Package and Mounting  1760-ball FCBGA (1760-BBGA) surface-mount package, supplier device package size 42.5 × 42.5 mm for compact board layouts.
• Operating Range  Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• High-density logic designs  Use the large logic element count to implement complex state machines, custom processing pipelines or large combinational logic networks.
• Memory-intensive functions  Leverage approximately 60.5 Mbits of embedded RAM for frame buffering, FIFO structures and on-chip data storage.
• High I/O systems  Deploy in designs requiring many external interfaces or parallel data paths, taking advantage of 702 I/O pins.

Unique Advantages

• High logic capacity: 1,176,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• Substantial embedded memory: Approximately 60.5 Mbits of on-chip RAM reduces dependence on external memory and lowers latency for data-intensive tasks.
• Large I/O complement: 702 I/O pins simplify connection to peripherals and parallel interfaces without extensive external multiplexing.
• Compact FCBGA package: The 1760-ball FCBGA (42.5 × 42.5 mm) provides high pin density in a surface-mount form factor for space-constrained PCBs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match standard commercial application environments.
• RoHS compliant: Designed to meet environmental compliance expectations for modern electronic manufacturing.

Why Choose XCKU095-1FFVB1760C?

The XCKU095-1FFVB1760C positions itself as a high-capacity FPGA solution for commercial designs that require extensive on-chip logic, significant embedded memory and a large number of I/O pins in a compact FCBGA package. Its combination of 1,176,000 logic elements, approximately 60.5 Mbits of RAM and 702 I/Os supports integration of complex digital subsystems onto a single device.

This device is suited to teams seeking a commercially graded, RoHS-compliant FPGA with a defined core voltage range and surface-mount 1760-ball FCBGA package. It provides a scalable platform for designs where logic density, embedded memory and I/O count are primary selection criteria.

Request a quote or submit an inquiry to get pricing and availability for the XCKU095-1FFVB1760C and to discuss integration details with our team.