XCKU095-1FFVB2104C

IC FPGA 702 I/O 2104FCBGA
Part Description

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 702 60518400 1176000 2104-BBGA, FCBGA

Quantity 7 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package2104-FCBGA (47.5x47.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case2104-BBGA, FCBGANumber of I/O702Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs67200Number of Logic Elements/Cells1176000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits60518400

Overview of XCKU095-1FFVB2104C – Kintex® UltraScale™ FPGA, 2104-FCBGA (47.5×47.5)

The XCKU095-1FFVB2104C is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD. It delivers high logic capacity and embedded memory in a 2104-FCBGA surface-mount package, with on-package I/O and a defined commercial operating range.

With approximately 1,176,000 logic elements, roughly 60.5 Mbits of embedded memory, and 702 I/Os, this device is specified for designs that require large programmable logic resources, significant on-chip RAM, and a compact FCBGA footprint. The device is RoHS compliant and rated for commercial temperature operation.

Key Features

  • Core Logic  Approximately 1,176,000 logic elements provide substantial programmable logic capacity for complex digital designs.
  • Embedded Memory  Approximately 60.5 Mbits of on-chip RAM enable large buffer and storage resources without external memory dependencies.
  • I/O Count  702 I/O pins support extensive interfacing and high-pin-count external connectivity within the single-package solution.
  • Package & Mounting  2104-FCBGA (2104-BBGA) package, supplier device package 2104-FCBGA (47.5×47.5), designed for surface-mount assembly to conserve board area.
  • Power  Specified core supply voltage range of 922 mV to 979 mV for the device core domain.
  • Operating Conditions & Grade  Commercial grade device rated for operation from 0 °C to 85 °C and compliant with RoHS requirements.

Unique Advantages

  • High Logic Density: Large logic element count supports complex logic integration and wide parallelization within a single FPGA.
  • Substantial On‑Chip Memory: Approximately 60.5 Mbits of embedded RAM reduces dependence on external memory for buffering and data storage.
  • Extensive I/O Availability: 702 I/Os accommodate multi-channel interfaces and high-pin-count connectivity without additional multiplexing hardware.
  • Compact FCBGA Package: 2104-FCBGA (47.5×47.5) allows high resource density in a surface-mount form factor for space-constrained PCBs.
  • Defined Power Envelope: Core voltage range of 922 mV–979 mV provides clear parameters for power-supply design and sequencing.
  • RoHS-Compliant Commercial Grade: Meets RoHS requirements and is specified for 0 °C–85 °C operation for commercial deployments.

Why Choose XCKU095-1FFVB2104C?

The XCKU095-1FFVB2104C positions itself as a high-capacity Kintex® UltraScale™ FPGA option for designs that require significant programmable logic, on-chip memory, and extensive I/O in a compact FCBGA footprint. Its defined supply voltage range and commercial temperature rating make it suitable for mainstream electronic products and development platforms that need verifiable device-level parameters.

As part of the Kintex UltraScale family, this device provides a pathway for designers seeking to consolidate functions on-chip while maintaining clear electrical and thermal specifications. The combination of logic elements, embedded RAM, and high I/O count supports scalability within complex digital systems and reduces board-level component count.

Request a quote or submit a sales inquiry to obtain pricing, availability, and sample information for the XCKU095-1FFVB2104C. Provide your requirements to receive a tailored response for procurement and project planning.

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