XCKU095-1FFVA1156C

The XCKU095-1FFVA1156C is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1156-FCBGA (35×35) package. It combines high logic capacity, substantial on-chip memory and a large I/O count to address designs that require dense programmable logic and significant embedded RAM.

As a commercial-grade, surface-mount FPGA, it is intended for applications operating within a 0 °C to 85 °C range and powered from a supply between 922 mV and 979 mV. The device is RoHS compliant.

Key Features

• Core Logic  Approximately 1,176,000 logic elements provide extensive programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 60.5 Mbits of on-chip RAM enable local data buffering, frame storage and intermediate processing without immediate external memory dependence.
• I/O Density  520 user I/Os support high pin-count interfaces and numerous parallel connections to peripherals and boards.
• Power  Designed for operation from a supply range of 922 mV to 979 mV, allowing precise power budgeting in system designs.
• Package & Mounting  1156-FCBGA (35×35) package in a surface-mount format provides a compact, ball-grid array footprint for board-level integration.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for commercial electronic applications.
• Environmental Compliance  RoHS compliant, supporting lead-free assembly and regulatory requirements for many markets.

Typical Applications

• High-density digital systems  Deploy complex custom logic and large parallel processing blocks using the FPGA’s 1,176,000 logic elements and embedded memory.
• I/O-intensive interfaces  Implement multi-channel data I/O, parallel buses and numerous peripheral connections with 520 available I/Os.
• Memory-hungry processing  Take advantage of approximately 60.5 Mbits of on-chip RAM for buffering, packet processing or frame storage without immediate external memory.
• Commercial electronic products  Integrate into commercial-grade systems that operate within 0 °C to 85 °C and require a surface-mount FCBGA implementation.

Unique Advantages

• Highly scalable logic capacity: Large logic element count enables implementation of complex, multi-function designs on a single device.
• Substantial on-chip memory: Approximately 60.5 Mbits of embedded RAM reduces reliance on external memory for many buffering and processing tasks.
• High I/O count: 520 I/Os support extensive external interfacing and parallel connectivity requirements.
• Compact system footprint: 1156-FCBGA (35×35) packaging provides a dense, surface-mount solution for space-constrained boards.
• Defined power envelope: Narrow supply range (922 mV–979 mV) supports tight power budgeting and system-level power management.
• Regulatory readiness: RoHS compliance simplifies environmental and assembly considerations for commercial products.

Why Choose XCKU095-1FFVA1156C?

The XCKU095-1FFVA1156C positions itself as a high-density, commercially graded Kintex® UltraScale™ FPGA that brings together a large logic fabric, significant embedded memory and broad I/O capability in a single 1156-FCBGA package. It is well suited to designers who need to consolidate complex logic, heavy buffering and numerous external interfaces into a compact surface-mount solution.

For development teams and procurement focused on commercial electronic products, this FPGA offers a clear set of verifiable attributes—logic capacity, embedded RAM, I/O count, package format, operating temperature range and supply voltage—that support scalable designs and predictable integration into board-level architectures.

Request a quote or submit an inquiry to initiate pricing and availability for the XCKU095-1FFVA1156C. Our team can provide the next steps for procurement and volume information.