XCKU095-1FFVA1156I

The XCKU095-1FFVA1156I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC offering high logic capacity and substantial on-chip memory. It integrates approximately 1,176,000 logic elements, roughly 60.5 Mbits of embedded RAM, and 520 device I/Os in a 1156-ball FCBGA (35×35) surface-mount package.

Specified for industrial operation, the device supports a supply voltage range of 922 mV to 979 mV and an operating temperature range from -40 °C to 100 °C, making it suitable for designs that require sustained performance across a wide temperature span.

Key Features

• Core Architecture  Kintex® UltraScale™ FPGA fabric delivering approximately 1,176,000 logic elements for high-density digital designs.
• Embedded Memory  Approximately 60.5 Mbits of on-chip RAM to support buffering, lookup tables, and data-path implementations.
• I/O Resources  520 accessible device I/Os to support complex interfacing and parallel signal connectivity.
• Package & Mounting  1156-ball FCBGA (35×35) surface-mount package providing a compact, board-level integration option.
• Power  Core supply specified between 922 mV and 979 mV to match system power-rail planning and sequencing needs.
• Temperature & Grade  Industrial-grade device rated for operation from -40 °C to 100 °C for temperature-tolerant deployments.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• High-density digital logic implementations  Use the device where large numbers of logic elements are required to implement complex custom logic and state machines.
• Memory-intensive designs  Leverage approximately 60.5 Mbits of embedded RAM for buffering, packet queues, and data-path acceleration.
• I/O-heavy systems  Utilize 520 I/Os to connect multiple peripherals, parallel interfaces, and multi-channel front-ends.

Unique Advantages

• High logic density: Approximately 1,176,000 logic elements allow consolidation of large digital functions into a single FPGA, reducing overall system complexity.
• Significant on-chip memory: Approximately 60.5 Mbits of embedded RAM supports large buffers and state storage without external memory.
• Extensive I/O capability: 520 I/Os enable wide parallelism and dense connectivity for multi-interface systems.
• Industrial temperature rating: Operation from -40 °C to 100 °C supports deployments where extended temperature tolerance is required.
• Compact FCBGA package: 1156-ball (35×35) surface-mount package provides a compact footprint for board-level integration.
• Regulatory compliance: RoHS compliant to support environmentally conscious manufacturing processes.

Why Choose XCKU095-1FFVA1156I?

The XCKU095-1FFVA1156I combines substantial logic capacity, abundant embedded memory, and high I/O count in a compact FCBGA package, positioning it for designs that require consolidation of complex digital functions and dense interfacing. Its industrial-grade temperature range and defined supply voltage window support reliable operation across a wide set of environments.

This part is suitable for teams and projects that need scalable FPGA resources and a compact integration form factor while maintaining compliance with RoHS requirements. The combination of on-chip resources and I/O density helps simplify board-level architecture and manage system-level BOM complexity.

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