XCKU085-3FLVA1517E

The XCKU085-3FLVA1517E is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD supplied in a 1517-FCBGA package. It provides a large programmable fabric with 1,088,325 logic elements and approximately 58.3 Mbits of embedded memory, paired with 624 user I/Os for high-density, flexible system integration.

Designed for surface-mount assembly and rated for extended temperature operation, this device is well-suited to designs that require significant on-chip logic capacity, embedded memory, and high I/O count within a compact 1517-FCBGA (40×40) footprint.

Key Features

• Core Logic 1,088,325 logic elements provide extensive programmable resources for complex custom logic and parallel processing implementations.
• Embedded Memory Approximately 58.3 Mbits of on-chip RAM available to support large buffers, FIFOs, and local data storage for high-throughput designs.
• I/O Capacity 624 user I/Os enable broad interfacing options for multiple external peripherals, high-speed buses, and multi-channel systems.
• Power Supply Core voltage supply range of 970 mV to 1.03 V to match platform power-rail requirements.
• Package and Mounting 1517-BBGA (FCBGA) package, supplier device package 1517-FCBGA (40×40), designed for surface-mount assembly to facilitate compact board layouts.
• Temperature and Grade Extended grade rating with an operating temperature range of 0 °C to 100 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Custom digital systems Implement large-scale, programmable logic using the device's 1,088,325 logic elements and substantial on-chip RAM to realize complex finite state machines, datapaths, and accelerators.
• High-density I/O interfacing Use the 624 user I/Os to connect multiple peripherals, parallel interfaces, or multi-channel data streams within a single FPGA solution.
• Embedded memory dependent designs Leverage approximately 58.3 Mbits of embedded memory to support buffering, packet processing, and local data storage needs without external memory in early prototyping or integration stages.

Unique Advantages

• Large programmable fabric: 1,088,325 logic elements deliver capacity for extensive custom logic integration, reducing the need for multiple devices.
• Significant on-chip memory: Approximately 58.3 Mbits of embedded RAM supports local data handling and reduces dependency on external memory for many use cases.
• High I/O count: 624 user I/Os enable complex system-level interfacing and simplify board-level routing by consolidating functions into a single device.
• Space-efficient package: 1517-FCBGA (40×40) provides a compact footprint suitable for dense board designs while supporting surface-mount assembly.
• Extended temperature rating: Operation from 0 °C to 100 °C supports deployment in environments where extended thermal range is required.
• RoHS compliant: Environmentally compliant manufacturing status aligns with common regulatory requirements.

Why Choose XCKU085-3FLVA1517E?

The XCKU085-3FLVA1517E balances high logic capacity, substantial embedded memory, and a large I/O complement in a compact 1517-FCBGA package—making it suitable for designs that consolidate complex digital functions into a single programmable device. Its extended grade temperature range and surface-mount package support practical deployment in applications requiring robust thermal performance and compact board integration.

This device is aimed at engineers and teams who need scalable programmable resources and significant on-chip storage while maintaining a high pin count for system-level connectivity. The combination of logic density, memory, and I/O make it a pragmatic choice for advanced prototype and production designs where consolidation and flexibility matter.

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