XCKU095-2FFVB2104E

The XCKU095-2FFVB2104E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It combines high logic capacity, substantial on-chip memory, and a high-density I/O count in a 2104-FCBGA surface-mount package.

With 1,176,000 logic elements and approximately 60.5 Mbits of embedded memory, this device is suited to complex digital designs that require significant programmable logic, memory resources, and plentiful external connectivity while operating within an extended temperature range.

Key Features

• Large logic capacity  Equipped with 1,176,000 logic elements to support complex combinational and sequential logic implementations.
• Embedded memory  Approximately 60.5 Mbits of on-chip RAM for local buffering, data storage, and state retention.
• High I/O count  Provides 702 user I/O pins to enable dense external connectivity and interface options from a single package.
• Compact, high-density package  Delivered in a 2104-FCBGA package (47.5 × 47.5 mm) designed for surface-mount assembly.
• Low-voltage core supply  Operates with a core voltage supply range of 922 mV to 979 mV to match system power requirements.
• Extended operating range  Rated for operation from 0°C to 100°C and designated as Extended grade for thermal considerations in system design.
• Environmental compliance  RoHS compliant, supporting regulatory requirements for lead-free manufacturing.

Unique Advantages

• High logic density: The device’s 1.17 million logic elements enable consolidation of large logic functions into a single FPGA.
• Substantial on-chip memory: Approximately 60.5 Mbits of embedded RAM supports high-capacity buffering and on-chip data handling.
• Extensive I/O resources: 702 I/O pins provide flexibility for interfacing with multiple peripherals and high-pin-count systems.
• Space-efficient package: The 2104-FCBGA (47.5 × 47.5 mm) package delivers high functionality in a compact surface-mount form factor.
• Designed for system-level integration: Combined logic, memory, and I/O in a single device help simplify board-level partitioning and interconnect.
• Compliance and manufacturing readiness: RoHS compliance and surface-mount packaging support modern production processes.

Why Choose XCKU095-2FFVB2104E?

The XCKU095-2FFVB2104E positions itself as a high-capacity FPGA option for designs that require significant programmable logic, on-chip memory, and a large number of I/Os within a single, surface-mount package. Its extended temperature grade and controlled core voltage range make it suitable for systems that require reliable operation across typical commercial temperature ranges.

This part is well suited to engineering teams and procurement looking for a scalable FPGA building block that consolidates logic, memory, and connectivity while meeting RoHS requirements and supporting compact board layouts.

Request a quote or submit an inquiry to obtain pricing and availability for the XCKU095-2FFVB2104E and to discuss how it fits your next FPGA design.