XCKU115-1FLVA1517C

The XCKU115-1FLVA1517C is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD supplied in a 1517-FCBGA (40×40) package. This commercial-grade, surface-mount device provides a high count of logic elements, substantial on-chip RAM, and a large number of I/O pins for integration into complex digital designs.

Key device parameters include 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory, 624 I/O, a supply voltage range of 922 mV to 979 mV, and an operating temperature range of 0 °C to 85 °C.

Key Features

• Device Type  Field Programmable Gate Array (FPGA) IC providing reprogrammable digital logic capabilities.
• Logic Capacity  1,451,100 logic elements for implementing large-scale digital logic and complex processing functions.
• Embedded Memory  Approximately 77.7 Mbits of total on-chip RAM for buffering, lookup tables, and memory-intensive logic.
• I/O Resources  624 I/O pins to support abundant peripheral, bus, and interface connections.
• Package & Mounting  1517-BBGA, FCBGA (1517-FCBGA 40×40) package; surface-mount mounting type for PCB integration.
• Power  Nominal supply voltage range of 922 mV to 979 mV to match platform power domains.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Implement large, complex logic networks and custom processing pipelines using the device's 1,451,100 logic elements.
• Memory-intensive functions  Leverage approximately 77.7 Mbits of embedded RAM for buffering, on-chip data storage, and state machines.
• I/O-rich systems  Support extensive peripheral and interface connectivity with 624 available I/O pins.

Unique Advantages

• Large programmable capacity: 1,451,100 logic elements enable consolidation of multiple functions into a single device.
• Significant on-chip memory: Approximately 77.7 Mbits of RAM reduces external memory dependence for many designs.
• High I/O count: 624 I/O pins provide flexibility for complex interconnect and multi-interface designs.
• Compact package: 1517-FCBGA (40×40) provides a high-density footprint for board-level integration.
• Commercial temperature range: Rated 0 °C to 85 °C to match standard commercial applications and environments.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCKU115-1FLVA1517C?

The XCKU115-1FLVA1517C delivers a combination of high logic density, substantial embedded memory, and extensive I/O in a compact FCBGA package, making it suitable for designs that require integrated, programmable digital resources. As an AMD Kintex® UltraScale™ device, it provides the raw device resources needed to implement large-scale logic, memory buffering, and rich interfacing within a single component.

This part is appropriate for teams and projects that need a commercial-grade FPGA solution with clear electrical and thermal parameters (supply 922–979 mV, operating 0 °C–85 °C) and prefer a surface-mount 1517-FCBGA package for PCB assembly and integration.

Request a quote or submit an inquiry today to check availability and obtain pricing for the XCKU115-1FLVA1517C.