XCKU095-2FFVC1517I

The XCKU095-2FFVC1517I is a Kintex® UltraScale™ field programmable gate array (FPGA) supplied in a 1517-FCBGA (40×40) package. It delivers a high-density programmable fabric with 67,200 CLBs and 1,176,000 logic elements, making it suitable for designs requiring extensive on-chip logic and I/O capacity.

With approximately 60.5 Mbits of embedded memory, 520 user I/O pins, an industrial operating temperature range, and a low core supply window, this device targets applications that demand dense logic integration, significant embedded memory, and robust environmental tolerance.

Key Features

• Core Logic  67,200 configurable logic blocks (CLBs) and 1,176,000 logic elements provide large-scale programmable logic capacity for complex designs.
• Embedded Memory  Approximately 60.5 Mbits of on-chip RAM to support buffering, state storage, and data processing without external memory dependence.
• High I/O Count  520 user I/O pins enable extensive external connectivity for parallel interfaces, sensor arrays, and multi-channel systems.
• Power Domain  Core supply operating range from 922 mV to 979 mV, allowing precise power budgeting and design alignment to system voltage rails.
• Package & Mounting  1517-FCBGA (40×40) package in a surface-mount form factor for compact board integration and high pin density.
• Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C, supporting deployments in a wide range of environmental conditions.
• Regulatory Compliance  RoHS compliant, simplifying material compliance efforts for manufacturing and procurement.

Typical Applications

• High-density programmable logic  Used where large amounts of logic and CLBs are required to implement complex digital functions and custom processing pipelines.
• Memory-intensive functions  Ideal for designs that benefit from substantial on-chip RAM for buffering, packet memory, or lookup storage without relying solely on external memory.
• I/O-centric systems  Suited to applications needing many external interfaces—up to 520 I/Os—for parallel data acquisition, control, or peripheral connectivity.
• Industrial environments  Designed for deployment in systems operating across -40 °C to 100 °C where industrial-grade reliability is required.

Unique Advantages

• High logic density: The combination of 67,200 CLBs and 1,176,000 logic elements enables consolidation of complex functions into a single device, reducing BOM count.
• Substantial embedded memory: Approximately 60.5 Mbits of on-chip RAM reduces external memory dependency and simplifies board design.
• Extensive I/O capability: 520 user I/Os provide flexibility for multi-channel interfaces and expansion without additional bridge devices.
• Industrial temperature range: Operation from -40 °C to 100 °C supports ruggedized applications and broader deployment scenarios.
• Compact, high-density package: 1517-FCBGA (40×40) surface-mount package delivers high pin count in a compact footprint for space-constrained designs.
• Regulatory alignment: RoHS compliance facilitates integration into products that require lead-free material compliance.

Why Choose XCKU095-2FFVC1517I?

The XCKU095-2FFVC1517I positions itself as a high-capacity, industrial-grade FPGA option within the Kintex UltraScale family, offering a balance of large programmable logic resources, significant embedded memory, and a high I/O count. Its package and electrical characteristics support compact, performance-oriented designs where on-chip resources and environmental tolerance matter.

This device is well suited to engineers and procurement teams seeking a single-chip solution to reduce board-level complexity, preserve board space, and deliver scalable programmable capability backed by an established UltraScale architecture.

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