XCKU11P-L2FFVE1517E

The XCKU11P-L2FFVE1517E is a Kintex® UltraScale+™ field programmable gate array (FPGA) designed for high-density programmable logic applications. It integrates a large logic fabric, significant on-chip memory, and a broad I/O count in a 1517-FCBGA package to support complex digital designs.

With 653,100 logic elements, approximately 54 Mbits of embedded memory, and 512 I/O, this device is targeted at designs that require high logic capacity, substantial local memory, and extensive external connectivity while maintaining a compact surface-mount package footprint.

Key Features

• Core Architecture  Kintex® UltraScale+™ FPGA fabric providing 653,100 logic elements for implementing complex programmable logic.
• Embedded Memory  Approximately 54 Mbits of on-chip RAM to support data buffering, packet buffering, and local storage needs without external memory in some use cases.
• I/O Capacity  512 user I/O pins to interface with a wide range of external devices and high-pin-count systems.
• Power Supply  Operates with core supply voltage in the range of 698 mV to 876 mV, enabling compatibility with targeted system power architectures.
• Package & Mounting  1517-FCBGA (1517-BBGA) surface-mount package, supplier package size 1517-FCBGA (40×40) for compact board-level integration.
• Temperature & Grade  Extended-grade device rated for operation from 0 °C to 100 °C.
• Regulatory  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• High-density logic systems  Implement complex programmable logic and custom processing functions using the device's 653,100 logic elements and substantial embedded memory.
• Data buffering and local storage  Use the approximately 54 Mbits of on-chip RAM for packet buffering, FIFO implementations, and latency-sensitive data staging.
• I/O-intensive designs  Leverage 512 I/O pins to connect to multiple peripherals, sensors, or interface subsystems on compact PCB layouts.

Unique Advantages

• Large programmable fabric: 653,100 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 54 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs, simplifying design and improving performance.
• High I/O density: 512 I/O pins enable broad connectivity for multi-channel systems and complex peripheral integration without multiple interface chips.
• Compact FCBGA packaging: 1517-FCBGA (40×40) surface-mount package balances high pin count with a compact board footprint for space-constrained designs.
• Extended temperature rating: 0 °C to 100 °C operation supports deployment in thermally demanding applications within the specified range.
• RoHS compliant: Meets lead-free assembly requirements for modern electronics manufacturing.

Why Choose XCKU11P-L2FFVE1517E?

The XCKU11P-L2FFVE1517E positions itself as a high-capacity, highly integrated Kintex UltraScale+ FPGA option for designs that require substantial logic resources, on-chip memory, and extensive I/O in a compact FCBGA package. Its combination of 653,100 logic elements, approximately 54 Mbits of embedded memory, and 512 I/O supports consolidation of complex functions and streamlined system architectures.

This device is well suited for engineering teams and procurement groups seeking a programmable platform that delivers scalability, board-level integration, and clear electrical and thermal operating parameters (698 mV–876 mV core supply, 0 °C–100 °C operating range), along with RoHS compliance for modern manufacturing workflows.

Request a quote or submit an inquiry to obtain pricing, availability, and support information for the XCKU11P-L2FFVE1517E. Our team can provide the next steps for procurement and integration into your design cycle.