XCKU13P-2FFVE900I

The XCKU13P-2FFVE900I is a Kintex® UltraScale+™ field programmable gate array (FPGA) from AMD. It integrates a large logic fabric and substantial on-chip memory to support complex digital designs.

Designed for industrial use, this surface-mount device provides approximately 746,550 logic elements, approximately 70.656 Mbits of embedded memory, 304 user I/O, RoHS compliance, and an operating temperature range of −40 °C to 100 °C, with a core voltage range of 825 mV to 876 mV.

Key Features

• Core Logic Capacity  Approximately 746,550 logic elements, suitable for large-scale programmable logic implementation.
• Embedded Memory  Approximately 70.656 Mbits of on-chip RAM to support buffering, state machines, and data-intensive logic functions.
• I/O Resources  304 available user I/O pins to interface with external peripherals and high-density board-level connections.
• Power Supply  Core voltage range from 825 mV to 876 mV to match system power-rail requirements.
• Package & Mounting  900-ball FCBGA package (900-FCBGA, 31×31) in a surface-mount form factor for high-density PCB assembly.
• Industrial Temperature & Grade  Rated industrial grade with an operating range of −40 °C to 100 °C for deployment in temperature-demanding environments.
• Regulatory Status  RoHS compliant.

Typical Applications

• High-density digital processing  Use the device where large programmable logic capacity and substantial embedded memory are required to implement complex algorithms and datapaths.
• Networking and communications  Leverage the combination of on-chip RAM and numerous I/O for packet buffering, protocol bridging, and board-level interfacing.
• Industrial control and automation  Industrial-grade temperature rating and robust packaging make the FPGA suitable for control systems and sensor/actuator interfacing in industrial environments.
• Custom hardware acceleration  Deploy the FPGA to implement application-specific accelerators that require extensive logic resources and local memory.

Unique Advantages

• Large programmable capacity: The approximately 746,550 logic elements enable implementation of complex, highly parallel logic architectures without offloading to additional devices.
• Substantial embedded memory: Approximately 70.656 Mbits of on-chip RAM reduces dependence on external memory for buffering and state retention, simplifying board design.
• High I/O density: 304 user I/O pins provide flexibility for multi-channel interfaces and dense system connectivity.
• Industrial thermal performance: Rated for −40 °C to 100 °C operation to meet the demands of temperature-challenging deployments.
• Compact, manufacturable package: 900-FCBGA (31×31) surface-mount package supports high-density PCB layouts and standard assembly processes.
• Regulatory compliance: RoHS compliance supports environmentally responsible manufacturing and deployment.

Why Choose XCKU13P-2FFVE900I?

The XCKU13P-2FFVE900I combines a large logic fabric, extensive on-chip memory, and a high I/O count in a compact 900-ball FCBGA package, making it well suited for complex, memory-intensive designs that must operate across industrial temperature ranges. Its specified core voltage range and surface-mount packaging simplify integration into power- and space-constrained systems.

This FPGA is a practical choice for engineering teams and procurement looking for a high-density, industrial-grade programmable device capable of addressing demanding digital processing, networking, and control applications while maintaining RoHS compliance.

Request a quote or submit an inquiry to obtain pricing and availability for the XCKU13P-2FFVE900I.