XCKU13P-L1FFVE900I

The XCKU13P-L1FFVE900I is a Kintex® UltraScale+™ field programmable gate array (FPGA) offered in a 900-ball FCBGA package. It provides a high logic capacity device with substantial on-chip memory and a broad I/O count tailored for complex digital designs.

With 746,550 logic elements, approximately 70.7 Mbits of embedded memory and 304 I/O, this device targets designs that require dense logic integration, significant local memory resources and flexible interfacing while supporting industrial temperature operation.

Key Features

• Core Capacity — 746,550 logic elements for implementing large-scale digital logic and state machines.
• Embedded Memory — Approximately 70.7 Mbits of on-chip RAM to support buffering, FIFOs and local data storage.
• I/O Count — 304 general-purpose I/O pins to support wide parallel interfaces and multiple high-density connections.
• Power and Supply — Operates from a core voltage supply range of 698 mV to 876 mV for compatibility with modern low-voltage core rails.
• Package — 900‑ball FCBGA (900‑FCBGA, 31×31) surface-mount package suitable for compact, high-density board layouts.
• Operating Range — Industrial grade with an operating temperature range of −40 °C to 100 °C to meet demanding thermal environments.
• RoHS Compliance — RoHS-compliant lead-free device.

Typical Applications

• High‑density digital processing — Implement large digital pipelines and parallel algorithms using 746,550 logic elements and substantial embedded memory.
• Data buffering and packet processing — Use approximately 70.7 Mbits of on-chip RAM for packet queuing, buffering and real-time data staging.
• Multi‑interface systems — Leverage 304 I/O to connect multiple external interfaces, sensors and peripheral devices in a single device.
• Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) supports deployment in factory and field equipment requiring extended operating ranges.

Unique Advantages

• High logic density: 746,550 logic elements enable consolidation of complex functions into a single FPGA, reducing PCB BOM and board space.
• Large on‑chip memory: Approximately 70.7 Mbits of embedded RAM reduces reliance on external memory, improving latency and simplifying system design.
• Extensive I/O: 304 I/O pins allow flexible connectivity and accommodate parallel data paths without external multiplexing.
• Industrial temperature support: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Compact, high-density package: 900‑FCBGA (31×31) surface-mount package provides a balance of pin count and board footprint for space-constrained designs.
• RoHS compliant: Meets lead‑free requirements for regulated markets and manufacturing processes.

Why Choose XCKU13P-L1FFVE900I?

The XCKU13P-L1FFVE900I positions itself as a high-capacity, industrial-grade FPGA option for engineers who need significant logic resources, abundant on-chip memory and a large I/O complement in a compact FCBGA package. Its combination of logic density and embedded RAM supports integration of complex data-paths and control logic into a single device.

This device is well suited for development teams focused on scalable digital architectures, systems requiring robust thermal performance, and designs that benefit from reduced external memory and interface components. The specifications provide a clear foundation for long-term deployment where density, integration and industrial operating range are primary considerations.

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