XCKU15P-1FFVA1156I

The XCKU15P-1FFVA1156I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD, supplied in a 1156-FCBGA surface-mount package. It delivers very high logic capacity and on-chip memory combined with a broad I/O complement for demanding, programmable hardware designs.

With industrial-grade temperature capability and a low-voltage core supply range, this device targets applications that require substantial programmable logic, significant embedded RAM, and numerous I/O in a compact FCBGA footprint.

Key Features

• Core Logic  1,143,450 logic elements suitable for large-scale programmable logic implementations.
• Embedded Memory  Approximately 82.33 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Density  516 I/O available to support extensive peripheral and signal interfacing.
• Power  Core voltage supply range of 825 mV to 876 mV to match system power-rail requirements.
• Package & Mounting  1156-FCBGA (35×35) package, 1156-BBGA/FCBGA format, designed for surface-mount assembly.
• Temperature & Grade  Industrial grade operation from -40 °C to 100 °C for deployment in harsher environments.

Typical Applications

• Industrial control and automation  Use the high logic capacity and extensive I/O to implement control algorithms, sensor aggregation, and custom timing logic in industrial systems.
• High-density signal processing  Leverage the large on-chip RAM and logic resources for buffering, streaming data paths, and real-time processing tasks.
• Test and measurement equipment  Deploy the device where flexible, high-density programmable logic and many I/Os are needed for custom measurement and data acquisition modules.

Unique Advantages

• Extensive programmable capacity: 1,143,450 logic elements enable complex custom logic and large-scale designs without immediate need for external logic expansion.
• Substantial embedded memory: Approximately 82.33 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 516 I/O simplifies integration with multiple peripherals, sensors, and external subsystems.
• Industrial temperature range: Rated from -40 °C to 100 °C for reliable operation in temperature-challenging environments.
• Compact, surface-mount FCBGA package: 1156-FCBGA (35×35) provides a dense footprint for high-performance systems while supporting standard surface-mount assembly processes.
• Low-voltage core operation: Core supply range of 825 mV to 876 mV enables integration with modern low-voltage power architectures.

Why Choose XCKU15P-1FFVA1156I?

This Kintex® UltraScale+™ FPGA balances very high programmable capacity, significant embedded memory, and a large I/O complement in an industrial-grade, surface-mount FCBGA package. Its combination of logic density, on-chip RAM, and operating temperature range makes it well suited for complex, I/O-intensive designs deployed in industrial and instrumentation environments.

Designers seeking a scalable, high-capacity FPGA from a recognized manufacturer will find this device appropriate for projects requiring substantial local memory, many I/Os, and robust temperature performance while maintaining a compact board footprint.

Request a quote or submit an inquiry to receive pricing and availability for the XCKU15P-1FFVA1156I. Our team can provide the information needed to evaluate this FPGA for your next design.