XCKU15P-1FFVA1760E

The XCKU15P-1FFVA1760E is a Kintex® UltraScale+™ field programmable gate array (FPGA) from AMD, supplied in a 1760-FCBGA package. It provides a large on-chip resource set including approximately 1,143,450 logic elements, approximately 82.3 Mbits of embedded memory and up to 512 I/O pins.

This device targets designs that require substantial logic capacity, significant embedded memory and a high I/O count while offering surface-mount packaging and extended-grade temperature operation for system-level integration.

Key Features

• Core architecture Kintex® UltraScale+™ FPGA family device designed for flexible, programmable logic integration.
• Logic capacity Approximately 1,143,450 logic elements to implement large-scale digital designs and complex logic functions.
• Embedded memory Approximately 82.3 Mbits of on-chip RAM for buffering, look-up tables and memory-intensive algorithms.
• I/O resources Up to 512 I/O pins to support multi-channel interfaces and dense connectivity requirements.
• Power supply Nominal supply range 825 mV to 876 mV for core voltage requirements.
• Package and mounting 1760-FCBGA (42.5 × 42.5 mm) package, surface-mount for standard PCB assembly processes.
• Operating range and grade Extended grade with an operating temperature range of 0°C to 100°C.
• Compliance RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• FPGA-based prototyping and development — Implements large logic prototypes or system emulation leveraging approximately 1,143,450 logic elements.
• High I/O systems — Supports multi-channel interfaces, data aggregation and board-level connectivity with up to 512 I/Os.
• Memory‑intensive algorithms — On-chip memory of approximately 82.3 Mbits accommodates buffering, lookup and algorithm state storage.
• Custom programmable logic solutions — Enables integration of complex, application-specific digital functions in a single device footprint.

Unique Advantages

• Substantial logic density: Approximately 1,143,450 logic elements let you consolidate complex functions into a single FPGA, reducing board-level component count.
• Large embedded memory: Approximately 82.3 Mbits of on-chip RAM helps minimize external memory dependency and lowers overall system latency.
• High I/O count: 512 I/Os provide flexibility for multi-channel designs and diverse peripheral interfacing without multiplexing compromises.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) supports dense system integration while remaining compatible with surface-mount assembly.
• Extended grade operation: Rated for 0°C to 100°C operation to match system thermal requirements within that range.
• Regulatory cleanliness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XCKU15P-1FFVA1760E?

The XCKU15P-1FFVA1760E combines a large logic fabric, significant embedded memory and a high I/O complement in a single 1760-FCBGA surface-mount package. Its resource set and extended-grade operating range make it well-suited for complex programmable designs that require substantial on-chip capacity and dense board-level integration.

This device is appropriate for teams and projects that need predictable, high-capacity FPGA resources—offering a clear path to consolidate designs, reduce external components and streamline system architecture while maintaining RoHS compliance.

Request a quote or submit a procurement inquiry for XCKU15P-1FFVA1760E to receive pricing and availability details for your next design.