XCKU15P-1FFVE1517I

The XCKU15P-1FFVE1517I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) manufactured by AMD. It provides a high-density programmable fabric with a large embedded memory complement and a broad I/O count for complex digital designs.

Targeted at industrial applications, the device combines substantial logic capacity and memory with an industrial operating temperature range and RoHS compliance, enabling deployment in designs that require extended temperature tolerance and significant on-chip resources.

Key Features

• Logic Capacity — 1,143,450 logic elements for implementing large-scale programmable logic, custom compute pipelines, and complex control functions.
• Embedded Memory — Approximately 82.33 Mbits of embedded memory to support buffers, FIFOs, and on-chip storage for data-intensive processing.
• I/O Resources — 512 user I/Os to accommodate dense peripheral interfacing, high-pin-count bus connections, and multi-channel I/O requirements.
• Package and Mounting — 1517-BBGA (1517-FCBGA, 40×40) package in a surface-mount form factor for high-density board integration.
• Power Supply Range — Core voltage specified between 825 mV and 876 mV for the device core supply.
• Operating Temperature — Rated for −40 °C to 100 °C operation for industrial-temperature deployments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control Systems — Industrial-rated temperature range and robust on-chip resources make the device suitable for programmable controllers, motion control, and automation logic.
• High-density Digital Processing — Large logic element count and significant embedded memory enable implementation of complex signal processing pipelines and custom accelerators on-chip.
• Multi-channel I/O and Interface Bridging — 512 I/Os provide capacity for wide parallel interfaces, multi-protocol bridging, and extensive sensor or actuator connectivity.

Unique Advantages

• Substantial Logic Resources: 1,143,450 logic elements allow integration of large programmable functions and reduce the need for multiple devices.
• Generous On-chip Memory: Approximately 82.33 Mbits of embedded memory supports sizeable buffers and local data storage to reduce external memory dependencies.
• High I/O Density: 512 I/Os enable flexible interfacing options for complex systems with multiple high-pin-count peripherals.
• Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployments in environments with wide temperature variations.
• Package for High-density Boards: 1517-FCBGA (40×40) in a surface-mount package facilitates compact PCB layouts and high signal integrity routing.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCKU15P-1FFVE1517I?

The XCKU15P-1FFVE1517I delivers a combination of high logic density, ample embedded memory, and extensive I/O in a market-proven Kintex® UltraScale+™ FPGA architecture. Its industrial operating range and surface-mount FCBGA packaging make it appropriate for designs that require sizable on-chip resources and reliable operation across a wide temperature span.

This device is well suited to engineering teams designing complex, programmable digital systems that need to consolidate functionality, minimize external components, and scale logic and memory capacity within a single FPGA platform.

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