XCKU15P-2FFVA1156E

IC FPGA 516 I/O 1156FCBGA
Part Description

Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 516 82329600 1143450 1156-BBGA, FCBGA

Quantity 1,151 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O516Voltage825 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs65340Number of Logic Elements/Cells1143450
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits82329600

Overview of XCKU15P-2FFVA1156E – Kintex® UltraScale+™ Field Programmable Gate Array (FPGA), 1156-FCBGA (35×35)

The XCKU15P-2FFVA1156E is an AMD Kintex® UltraScale+™ field programmable gate array supplied in a 1156-FCBGA (35×35) surface-mount package. It delivers a high-density programmable fabric along with substantial embedded memory and a large I/O complement for complex digital designs.

Key electrical and environmental parameters include a voltage supply range of 825 mV to 876 mV, an operating temperature range of 0 °C to 100 °C, and Extended grade qualification. The device is RoHS compliant.

Key Features

  • Core Logic  1,143,450 logic elements and 65,340 CLBs provide large programmable capacity for complex implementations and high gate-count designs.
  • Embedded Memory  Approximately 82.33 Mbits of on-chip RAM to support buffering, data storage, and local processing tasks.
  • I/O Capacity  516 I/O pins to interface with multiple peripherals, data streams, and external logic.
  • Power  Operates within a voltage supply range of 825 mV to 876 mV, enabling integration with low-voltage system power rails.
  • Package & Mounting  1156-BBGA, FCBGA package; supplier device package specified as 1156-FCBGA (35×35). Surface mount mounting type for PCB assembly.
  • Temperature & Grade  Extended grade device with an operating temperature range from 0 °C to 100 °C.
  • Compliance  RoHS compliant.

Unique Advantages

  • High programmable density: The combination of 1,143,450 logic elements and 65,340 CLBs supports densely packed logic and large-scale designs.
  • Substantial on-chip memory: Approximately 82.33 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-processing tasks.
  • Extensive I/O capability: 516 I/O points provide flexibility for multi-channel interfaces and high-pin-count system integration.
  • Compact, surface-mount FCBGA package: The 1156-FCBGA (35×35) package balances device density with a manufacturable surface-mount form factor.
  • Extended temperature operation: Extended grade and a 0 °C to 100 °C operating range support deployment in a range of controlled-environment applications.
  • Regulatory compliance: RoHS compliance supports use in assemblies requiring restricted-substance conformance.

Why Choose XCKU15P-2FFVA1156E?

The XCKU15P-2FFVA1156E positions itself as a high-capacity, high-memory FPGA offering from the Kintex UltraScale+ family, aimed at designs that require significant programmable resources and on-chip RAM while operating within a defined low-voltage supply window. Its combination of logic density, embedded memory, and a large I/O count makes it suitable for complex digital systems that need a compact FCBGA package and surface-mount PCB assembly.

With Extended grade operation and RoHS compliance, the device provides a balance of performance, integration, and environmental conformance, backed by AMD’s Kintex UltraScale+ lineage for teams focused on scalable, high-density programmable solutions.

Request a quote or submit an inquiry to receive pricing and availability information for the XCKU15P-2FFVA1156E.

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