XCKU15P-2FFVA1760I

The XCKU15P-2FFVA1760I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1760-FCBGA package (42.5×42.5 mm). Built for industrial-grade designs, it provides a high count of logic resources, substantial on-chip memory, and extensive I/O for dense, programmable digital systems.

Key Features

• Logic Capacity — 1,143,450 logic elements (cells) to implement complex programmable logic and custom digital functions.
• Configurable Logic Blocks — High CLB count to support large-scale logic designs and parallel processing architectures.
• Embedded Memory — Approximately 82.3 Mbits of on-chip RAM for buffering, data storage, and state machine implementation.
• High-Density I/O — 512 I/O pins to support broad peripheral interfacing and multi-channel data paths.
• Package and Mounting — 1760-BBGA (1760-FCBGA) package in a 42.5×42.5 mm footprint; surface-mount mounting type for board-level integration.
• Power — Supported supply range from 825 mV to 876 mV for core power domains.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in industrial environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control Systems — Industrial-grade temperature rating and high logic density enable programmable control, sequencing, and real-time processing in factory and process automation equipment.
• High-Density Digital Processing — Large logic cell count and substantial on-chip RAM support algorithm acceleration and complex data-path implementations.
• Multi‑I/O Embedded Designs — 512 I/O pins allow for extensive peripheral and sensor interfacing in embedded systems requiring many parallel signals.

Unique Advantages

• Large Programmable Fabric: 1,143,450 logic elements provide the resource headroom to consolidate multiple functions into a single device and reduce system BOM.
• Significant Embedded Memory: Approximately 82.3 Mbits of on-chip RAM reduces reliance on external memory for buffering and lookup operations, simplifying board design.
• High Pin Count: 512 I/O pins enable flexible interfacing and support for high-channel-count designs without additional multiplexing hardware.
• Industrial Robustness: Operation from −40 °C to 100 °C aligns with industrial deployment requirements for temperature resilience.
• Compact, Surface-Mount Package: 1760-FCBGA (42.5×42.5 mm) package offers a high-density footprint suitable for space-constrained PCBs.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCKU15P-2FFVA1760I?

The XCKU15P-2FFVA1760I positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial logic resources, embedded memory, and extensive I/O in a compact surface-mount footprint. Its combination of 1,143,450 logic elements, approximately 82.3 Mbits of on-chip RAM, and 512 I/O make it well suited for engineers consolidating complex digital functions and aiming to reduce external component count.

Choose this device when you need scalable programmable logic, robust operating temperature support, and a high-density package for industrial applications where long-term availability and integration flexibility are priorities.

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