XCKU15P-2FFVE1517I

The XCKU15P-2FFVE1517I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. This industrial-grade, surface-mount FPGA provides a large programmable fabric and embedded memory suitable for demanding digital designs that require high logic density, extensive I/O, and robust operating temperature range.

With 1,143,450 logic elements, approximately 82.33 Mbits of embedded memory, and 512 I/O, this device is designed for applications that need substantial on-chip resources, high interfacing capacity, and reliable operation across -40 °C to 100 °C.

Key Features

• Core Logic 1,143,450 logic elements for implementing large-scale custom digital logic and complex algorithms.
• Embedded Memory Approximately 82.33 Mbits of on-chip RAM to support data buffering, packet storage, and state machines.
• I/O Capacity 512 I/O pins to accommodate extensive peripheral connectivity and multi-channel interfacing.
• Power Supported voltage supply range of 825 mV to 876 mV for core power delivery requirements.
• Package & Mounting 1517-BBGA / 1517-FCBGA (40x40) package in a surface-mount format for board-level integration.
• Temperature & Grade Industrial grade with operating temperature range of -40 °C to 100 °C for deployment in temperature-variable environments.
• Environmental Compliance RoHS compliant to meet standard lead-free manufacturing requirements.

Typical Applications

• High-density digital processing — Use the device’s 1,143,450 logic elements and approximately 82.33 Mbits of embedded memory to implement large-scale custom logic, signal processing, or data-path acceleration.
• Multi-channel I/O systems — 512 I/O pins enable complex interfacing for systems that require numerous control, status, or data signals.
• Industrial control and automation — Industrial-grade operation and wide temperature range support deployment in factory automation, motor control, and instrumentation environments.
• Embedded system prototyping — Surface-mount 1517-FCBGA packaging and extensive on-chip resources make the device suitable for validating high-capacity FPGA designs.

Unique Advantages

• Large programmable fabric: 1,143,450 logic elements provide capacity to integrate complex functions on a single device, reducing system-level component count.
• Significant on-chip memory: Approximately 82.33 Mbits of embedded RAM minimizes external memory dependence for buffering and state storage.
• High I/O count: 512 I/O pins allow flexible interfacing to multiple peripherals and subsystems without additional multiplexing hardware.
• Industrial temperature rating: -40 °C to 100 °C operation supports deployment in environments with wide temperature swings.
• Compact surface-mount package: 1517-FCBGA (40×40) enables dense PCB integration while maintaining connection density.
• RoHS compliant: Conforms to lead-free manufacturing processes for regulatory and production requirements.

Why Choose XCKU15P-2FFVE1517I?

The XCKU15P-2FFVE1517I positions itself as a high-capacity, industrial-grade FPGA suited for designs that demand extensive logic resources, ample embedded memory, and broad I/O capability. Its specification set supports engineers developing complex digital systems that must operate reliably across a wide temperature range.

This device is appropriate for development teams and product designs prioritizing on-chip integration, reduced external component needs, and a compact FCBGA footprint. Its combination of logic density, memory, and I/O makes it a practical choice for scaling prototypes into production-grade hardware.

Request a quote or submit an inquiry to receive pricing and availability for the XCKU15P-2FFVE1517I FPGA. Our team will provide the information you need to move your design forward.