XCKU15P-3FFVA1156E

The XCKU15P-3FFVA1156E is a Kintex® UltraScale+™ field programmable gate array (FPGA) offered in a 1156-FCBGA package. It delivers a large programmable logic capacity combined with substantial on-chip memory and a broad I/O count for complex digital designs.

Targeted at designs requiring high logic density and extensive embedded memory, this extended-grade, surface-mount device supports operation across a 0 °C to 100 °C range and a core voltage supply window of 873 mV to 927 mV.

Key Features

• Logic Capacity  Provides 1,143,450 logic elements for implementing large-scale programmable logic and custom digital functions.
• Embedded Memory  Approximately 82.33 Mbits of on-chip RAM (82,329,600 bits) to support buffering, lookup tables and on-device data storage.
• I/O Resources  516 general-purpose I/Os to interface with external peripherals, memory, and high-pin-count systems.
• Power Supply Range  Core voltage supply range of 873 mV to 927 mV for device power planning and system integration.
• Package & Mounting  Available in a 1156-BBGA / 1156-FCBGA package (supplier device package: 1156-FCBGA, 35×35). Surface-mount mounting type for PCB assembly compatibility.
• Operating Temperature & Grade  Extended grade device rated for 0 °C to 100 °C operation.
• Regulatory  RoHS compliant.

Unique Advantages

• Large programmable fabric: The 1,143,450 logic elements enable complex logic integration and high-density designs without external logic expansion.
• Significant on-chip memory: Approximately 82.33 Mbits of embedded RAM reduces dependence on external memory for buffering and data processing.
• High I/O count: 516 I/Os support rich interfacing options for multi-channel systems and high-pin-count peripherals.
• Packaging options for board-level integration: The 1156-FCBGA (35×35) package and surface-mount mounting simplify PCB assembly and mechanical planning.
• Extended operating range: Rated for 0 °C to 100 °C operation to meet designs requiring extended-grade temperature operation.
• RoHS compliance: Meets RoHS requirements for environmental and manufacturing considerations.

Why Choose XCKU15P-3FFVA1156E?

The XCKU15P-3FFVA1156E combines high logic density, substantial embedded memory, and a large I/O complement in a single surface-mount FCBGA package. Its extended-grade temperature rating and defined core voltage window make it suitable for projects that need reliable, on-device resources and predictable power planning.

This part is well suited for teams and projects that require significant programmable logic and on-chip RAM while maintaining a compact board footprint and surface-mount assembly. The provided specifications enable straightforward evaluation for designs where logic capacity, memory, and I/O count are primary selection criteria.

Request a quote or submit an inquiry to obtain pricing and availability for XCKU15P-3FFVA1156E.