XCKU15P-3FFVE1517E

The XCKU15P-3FFVE1517E is a Kintex® UltraScale+™ field programmable gate array (FPGA) from AMD, provided in a 1517-FCBGA package. It combines a high logic element count with substantial on-chip RAM and a large I/O complement for demanding programmable-logic applications.

This device is suited for designs that require high programmable density, significant embedded memory, and robust I/O capability while operating within an extended temperature range and a defined supply voltage window.

Key Features

• Core Logic  Approximately 1,143,450 logic elements provide large programmable fabric for complex custom logic, parallel processing, and hardware acceleration tasks.
• Embedded Memory  Approximately 82.3 Mbits of on-chip RAM to support buffering, LUTs, and memory-intensive architectures without requiring external memory for many functions.
• I/O Density  512 user I/O pins to support wide data interfaces, multi-lane communication, and extensive peripheral connectivity.
• Power Supply  Specified operating supply range from 873 mV to 927 mV, enabling designs that require precise core-voltage targeting.
• Package & Mounting  1517-BBGA (1517-FCBGA, 40×40) surface-mount package offering a compact footprint for high-density board designs.
• Temperature & Grade  Extended grade with an operating temperature range of 0°C to 100°C for applications requiring above-room temperature operation.
• Regulatory  RoHS compliant for compatibility with standard environmental and manufacturing practices.

Typical Applications

• Custom Hardware Acceleration  Leverage the high logic element count and on-chip RAM to implement specialized accelerators for compute-intensive tasks.
• High-Density Signal Processing  Use large embedded memory and abundant logic resources for real-time signal processing pipelines and buffering.
• High-Throughput Interfaces  The 512 I/O pins support wide parallel buses and multi-lane interfaces for data acquisition and transport applications.
• Embedded System Platforms  Integrate programmable logic, on-chip memory, and extensive I/O in compact FCBGA form factors for advanced embedded designs.

Unique Advantages

• High Logic Density:  Approximately 1.14 million logic elements enable large, complex designs without immediate recourse to external co-processors.
• Substantial On-Chip Memory:  About 82.3 Mbits of embedded RAM reduces dependency on external memory for many buffering and state-storage needs.
• Broad I/O Capacity:  512 I/Os allow flexible interfacing options for multi-channel and multi-protocol designs.
• Compact, Surface-Mount Package:  1517-FCBGA (40×40) packaging supports dense board layouts while providing the footprint expected for high-pin-count FPGAs.
• Defined Operating Window:  Clear supply-voltage range (873 mV–927 mV) and extended temperature rating (0°C–100°C) help constrain system-level power and thermal design choices.

Why Choose XCKU15P-3FFVE1517E?

The XCKU15P-3FFVE1517E positions itself as a high-density programmable-logic option within the Kintex® UltraScale+™ family, offering a combination of extensive logic resources, sizeable embedded memory, and a large I/O count in a compact FCBGA package. Its defined voltage range and extended temperature grade make it appropriate for designs that require predictable supply and operating-temperature constraints.

This device is well suited to engineers building scalable hardware accelerators, signal-processing systems, and high-throughput embedded platforms that need significant on-chip resources with surface-mount packaging and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the XCKU15P-3FFVE1517E. Our team can provide the procurement details you need to move your design forward.